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Paper Titles
Preface, Organizing Committees and Sponsors
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Microstructure Modeling for Prediction of Thermal Conductivity of Plain Weave C/SiC Fibre Bundles Considering Manufacturing Flaws
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Effect of Annealing Process and Cold Reduction Ratio on Microstructure and Mechanical Property of 350MPa Grade Structural Hot Dip Galvanized Steel Sheets
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 109Preface, Organizing Committees and Sponsors

Preface, Organizing Committees and Sponsors

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Applied Mechanics and Materials (Volume 109)

Online since:

October 2011

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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