[1]
H. Zhao, J.Z. Cui, Electroless plating of silver on AZ31 magnesium alloy substrate, Surf Coatings Tech, 201 (2007)4512-4517.
DOI: 10.1016/j.surfcoat.2006.09.044
Google Scholar
[2]
T. X Liang, W. L Guo, Y. H Yan, C. H Tang, Electroless plating of silver on graphite powders and the study of its conductive adhesive, Int. J. Adhes. Adhes, 28 (2008)55-58.
Google Scholar
[3]
Q.W. Chen, Z.Y. Wang, J. Cai, L.T. Liu, The influence of ultrasonic agitation on copper electroplating of blind-vias for SOI three-dimensional integration, Microelectronic Engineering, 87 (2010)527-531.
DOI: 10.1016/j.mee.2009.06.035
Google Scholar
[4]
X. R Xu, X. J Luo, H. R Zhuang, W. L Li, B. L Zhang, Electroless silver coating on fine copper powder and its effects on oxidation resistance, Mater Lett, 57( 2003) 3987-3991.
DOI: 10.1016/s0167-577x(03)00252-0
Google Scholar
[5]
M.J. Santillán, N.E. Quaranta, A.R. Boccaccini, Titania and titania-silver nanocomposite coatings grown by electrophoretic deposition from aqueous suspensions, Surf Coatings Tech, 205 (2010) 2562-2571.
DOI: 10.1016/j.surfcoat.2010.10.001
Google Scholar
[6]
S. Akamaru, H. Yamamoto, T. Abe, Surface coating of microparticles with tungsten carbide by using the barrel sputtering system, Vacuum, 83(2008) 633-636.
DOI: 10.1016/j.vacuum.2008.04.052
Google Scholar
[7]
Y. Shacham-Diamand, A. Inberg, Y. Sverdlov, N. Croituru, Electroless Silver and Silver with Tungsten Thin Films for Microelectronics and Microelectromechanical System Applications, J. Electrochem. Soc, 147 (2000) 3345-3349.
DOI: 10.1149/1.1393904
Google Scholar
[8]
C. M. Ng, H. P. Oel and S. Y. Wu, Surface modification of plasma-pretreated high density polyethylene films by graft copolymerization for adhesion improvement with evaporated copper, Polym. Eng. Sci, 40 (2000) 1047-1055.
DOI: 10.1002/pen.11232
Google Scholar
[9]
B. Gao, H. Jiang and Z. Zhang, Studing on Reaction Mechanism of Silver-Plating for Micro Copper Particle, Chin. J. Inorg. Chem., 16 (2000) 669-674.
Google Scholar