Research on Thermal Deformation State of Mould Copper Plate with Different CC Technical Parameters

Li Gen Sun; Hui Rong Li; Jia Quan Zhang

doi:10.4028/www.scientific.net/AMM.117-119.949

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 117-119Research on Thermal Deformation State of Mould...

Research on Thermal Deformation State of Mould Copper Plate with Different CC Technical Parameters

Abstract:

Heat transfer coefficient, temperature of cooling water and casting speed have definitely influence for the mould thermal state, especially with the high temperature. The coupled visco-elasto-plastic FEM models have been presented for thermal process analysis of steel shell and the mould copper plates. It is shown that, the heat transfer coefficient and the temperature of cooling water have little influence to the maximum equivalent mises stress and equivalent strain of the mould; but the casting speed has a great influence, with the increasing casting speed from 1.0 to 1.6 m/min, equivalent mises stress creasing rate is reached to 8.7%, and the equivalent strain is also getting smaller.

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Periodical:

Applied Mechanics and Materials (Volumes 117-119)

Pages:

949-953

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.117-119.949

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Online since:

October 2011

Authors:

Li Gen Sun, Hui Rong Li, Jia Quan Zhang

Keywords:

CC Technical Parameters, Mould Copper Plate, Thermal Deformation State

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References

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