Formation of Intermetallic Compounds on the Bond Interface of Aluminum-Clad Copper and its Influence on Bond Tensile Strength

Wei Xie; Yamaguchi Tomiko; Knishio Kazumasa

doi:10.4028/www.scientific.net/AMM.117-119.984

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 117-119Formation of Intermetallic Compounds on the Bond...

Formation of Intermetallic Compounds on the Bond Interface of Aluminum-Clad Copper and its Influence on Bond Tensile Strength

Abstract:

Production of aluminium-clad copper has been performed using vacuum roll bonding, hundreds nm of intermetallic compounds are formed on the bond interface. On the tensile testing, it is broken from the base metal of aluminium and high bond tensile strength is available. In this study, heat treatment has been taken to aluminium-clad copper produced by vacuum roll bonding. Microstructure observation, EPMA, EDS and XRD have been carried to the investigation of the formation of intermetallic compounds. As a result, 3 types of intermetallic compounds such as CuAl₂, CuAl and Cu₉Al₄ were formed at the bond interface of aluminium-clad copper. And it was clarified that the apparent activation energy for growth behavior of CuAl and Cu₉Al₄ is lower than CuAl₂. The effect of intermetallic phases on bond strength has also been investigated with the growth of intermetallic compounds. The decrease of tensile strength has been clarified. The broken position is near the interface between CuAl₂ and CuAl. Furthermore, the bond strength of aluminum-clad copper is seriously affected by the thickness of CuAl₂.

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Periodical:

Applied Mechanics and Materials (Volumes 117-119)

Pages:

984-989

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.117-119.984

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Online since:

October 2011

Authors:

Wei Xie, Yamaguchi Tomiko, Knishio Kazumasa

Keywords:

Aluminum-Clad Copper, Bond Tensile Strength, Intermetallic Compound (IMC), Vacuum Roll Bonding

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