The Simulation Analysis of Mobile Phone Back Cover Injection Molding Based on Moldflow

Abstract:

Along with the rapid development of electronic communication technology and the widely application of mobile phones, it is required to shorten the production period ,to lower production cost and to increase the competitive power. The traditional design method obviously cannot satisfy the requirement of production, but the application of Moldflow software can solve it ,which can analysis the product structure reasonably, to realize the optimization design of the parts; which can formulate rational production process parameters, such as the filling time and the holding time etc; which can analyze the warping ,bubble, lack of material common defects ,to optimize mold design; which can design the die structure, such as reasonable pouring system,to shorten the cycle of mold design ,to reduce production cost and enhance the competitiveness of enterprises.

• Periodical: Applied Mechanics and Materials (Volumes 148-149)
• Pages: 282-285
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.148-149.282
• Online since: December 2011
• Authors: Ling Liu, Liang Wang
• Keywords: Injection Mold, Moldflow, Simulation

References

[1] Ma Wen-qi, Sun Hong-yi. The plastic molding simulation software technology foundation and application [M]. Beijing: China railway publishing house( 2006).

[2] Liu Shou-rong. The plastic molding engineering [M]. Beijing: mechanical industry publishing (2006).

[3] Shan Yan, Wang Bei, wang gang. The base of mould technology analysis on Moldflow [M]. Beijing: tsinghua university publishing(2009).

[4] Liu Lai-ling . Injection molding process [M]. Beijing: Mechanical industry press(2004).

[5] Song Jia-lin, Lin Qi-quan, Xie Gui-lan. The Moldflow application to keyboard panel molding [J]. Modern manufacturing engineering, 2008 (3), p.44.