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Copper Plating on the Carbon Fibers by Double Pulse

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Abstract:

The effects of positive and reverse working time, electroplating time, current density, duty cycle on the weight-gain rate were investigated. The optimized technical parameters were as follows: room temperature, 300 ms of positive working time, 30 ms of reverse working time, 40% of duty cycle, 8.20 ×10-5 A/mm2 of current density, 6 min of electroplating time. The quality of copper coating was checked with SEM. The adhesion between the coating and carbon fibers was tested by the method of psychro-thermal cycles. Additionally, comparison to pulse plating and direct current plating was made. The obtained results showed that a flat, detailed and well-crystalloid copper coating on the carbon fiber surface was obtained with the present conditions. The adhesion between the coating and carbon fibers was 450kPa.

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Periodical:

Applied Mechanics and Materials (Volumes 148-149)

Pages:

928-931

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.148-149.928

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Online since:

December 2011

Authors:

Song Gao, Ming Jie Fan, Gui Ping Wang

Keywords:

Carbon Fiber (CF), Copper Coating, Pulse Plating, Weight-Gain Rate

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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