Electroless Plating Nickel Film on Surface of Epoxy Resin and Evaluation of its Electromagnetic Shielding Effectiveness

Abstract:

Nickel coating was prepared on surface of Epoxy Resin plate by electroless plating process. Surface and section morphologies of the coatings were observed by scanning electron microscopy (SEM) and metallographic optic microscopy. Electromagnetic shielding effectiveness was evaluated via flanged coaxial electromagnetic shielding effectiveness tester. The results showed that the surface of the nickel coating prepared by electroless plating process was smooth, and its structure was fine and compact. The electroless deposition rate of the nickel coating reached at 12μm/h. In the frequency range of 300 kHz to 100MHz the electromagnetic shielding effectiveness of the nickel coating was above 60dB, and in the frequency range of 100MHz to 1.5GHz the electromagnetic shielding effectiveness of the nickel coating was above 44dB.

• Periodical: Applied Mechanics and Materials (Volumes 148-149)
• Pages: 963-967
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.148-149.963
• Online since: December 2011
• Authors: Peng Jin, Shi Yun Dong, Bin Shi Xu, Zhan Yong Song
• Keywords: Electroless Nickel Plating, Electromagnetic Shielding Effectiveness, Epoxy Resin (ER)

References

[1] Harper C A. Electronic materials and processes handbook. New York : Mc Graw-Hill (2005).

[2] Tobias Merkel, Michael Graeber, Lienhard Pagel. A new technology for fluidic Microsystems based on PCB technology. Sensors and Actuators, 77 (2), (1999), 98-105.

DOI: 10.1016/s0924-4247(99)00062-x

[3] Zweben C. Advances in composite materials for thermal management in electronic packaging. JOM, 6, (1998), 47-49.

[4] NARAYANAN TSNS, BASKARANBI, KRISH NAVENIAK, et al. Deposition of electroless Ni-P graded coatings and evaluat ion of their corrosion resistance. Surface & Coat ings Technology, 200, (2006), 3438-3445.

DOI: 10.1016/j.surfcoat.2004.10.014

[5] Domenech S C, Lima J E, Drago V, et a1. Electroless plating of nickel-phosphorous on surface-modified poly(ethylene terephthalate) films. Applied Surface Science, 220(1), (2003), 238-250.

DOI: 10.1016/s0169-4332(03)00815-8

[6] Chen C C, Hung C W, Yang S Y, et al. Effect of swelling pretreatment on the deposition structure on electroless copper of poly acrylonitrile nanocomposites for electromagnetic interference shielding. Journal of Applied Polymer Science, 109, (2008).

DOI: 10.1002/app.28463

[7] HE W Q, WANG H, WANG W C, et al. Electroless nickel plating on epoxy resin by using Ni/Cu colloid catalyst. Electroplating & Finishing, 25(3), (2006), 17-19 (in Chinese).

[8] WU X E, HU M, TIAN B, et al. Process of Coarsening Pretreatment of epoxy resin packaging material for electroless copper plating. Materials Protection, 39(12), (2006), 19-22 (in Chinese).

[9] ZHANG T C, TU X W, WANG X, et al. On metallized treatment of epoxy resin composites surface and its performance. Packaging Engineering, 30(9), (2009), 64-66 (in Chinese).

[10] Kou S C, Hung A. In situ measurement of the mixed potential of electroless copper deposition. Plating and Surface Finishing, 88(5), (2001), 119-123.

[11] Kou S C, Hung A. Effect of buffer on electroless copper deposition. Plating and Surface Finishing, 89(2), (2002), 48-52.

[12] N. Janda, Development of a predictive shielding effectiveness model for carbon fiber/nylon based composites, Master of Science Thesis, Chemical Engineering, Michigan Technological University, ( 2003).

[13] A Das, V K Kothari, A Kothari. Effect of various parameters on electromagnetic shielding effectiveness of textile fabrics. Indian Journal of Fibre & Textile Research, 34, (2009), 144-148.