Indoor Ultrasonic 3D Seamless Location and Wireless Communication of Metal Can

Xian Zhong Chen; Ran Ran Li; Qing Wen Hou

doi:10.4028/www.scientific.net/AMM.157-158.788

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 157-158Indoor Ultrasonic 3D Seamless Location and...

Indoor Ultrasonic 3D Seamless Location and Wireless Communication of Metal Can

Abstract:

A system with low-cost, low power consumption and wide range of ultrasonic positioning was designed. The node layout is the ultrasonic transmitter vertically installed on the top of the metal can as unknown node, the ultrasonic receivers as beacon nodes, 4 nodes installed on the ceiling and 4 nodes installed on the floor fixed position to receive ultrasonic. Ultrasonic sensor was designed with low power consumption microcontroller Ti MSP430F1611 and RF transceiver chip CC2420. Effective range is 10m, accuracy ± 2cm, launch angle , the system power 200 ~ 400uA/MIPS, 5V lithium battery-powered, Zigbee wireless communication protocol for data transmission. A new algorithm of node location module and Matlab software simulation result were established to achieve 3D seamless positioning of metal can in 20m*2m*2m indoor space.

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Periodical:

Applied Mechanics and Materials (Volumes 157-158)

Pages:

788-791

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.157-158.788

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Online since:

February 2012

Authors:

Xian Zhong Chen, Ran Ran Li, Qing Wen Hou

Keywords:

3D Seamless Location, Low Power Consumption, Metal Can, Ultrasonic, Wireless Communication, ZigBee

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References

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