Thermal Analysis and Cooling Optimization of the Built-In Micro Projector

Wei Wei; Ping Yang; Qian Hong He; Quay Le Chen

doi:10.4028/www.scientific.net/AMM.160.3

Paper Titles

Preface, Committees and Reviewers

Thermal Analysis and Cooling Optimization of the Built-In Micro Projector
p.3

The Oxygen-Ion Diffusion and Phase Transition in the La₂Mo_2-xW_xO₉ Samples Measured by Internal Friction Method
p.8

Research and Analysis on Electrolytic Preparation of High Purity Potassium High-Speed Rail Technology
p.12

A Simplified Method for Calculating Ultimate Strength of Pressure Hull in Deep-Sea Manned Submersible
p.17

A Novel Approach of Multiscale Feature Extraction for Gearbox Condition Monitoring
p.25

Vibration Suppression of Flexible Parallel Manipulator Based on Sliding Mode Control with Reaching Law
p.30

Dynamic Characteristics Analysis for Fluid-Solid Coupling of Vertical Lifting Pipe in Transporting Coarse Particles
p.35

Analysis of Loads at Crankshaft Bearing for Scroll Compressor
p.42

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 160Thermal Analysis and Cooling Optimization of the...

Thermal Analysis and Cooling Optimization of the Built-In Micro Projector

Abstract:

With the rapid development of the micro projector, the problems of its power consumption and heat dissipation have been increasingly serious. The thermal design can improve its reliability and cut costs at the design stage. This article selects DLP built-in micro projector provided by TI Company to analyze, uses thermal analysis software Flotherm to get the temperature distribution and temperature curves of the measuring points in the steady state, then compares the simulation results of the cooling optimization with the numerical analysis, which reduces the temperatures of thermal sources and shells. The conclusion supplies new theoretical basis on the development of mobile phones integrated with the projection function.

You might also be interested in these eBooks

Advances in Intelligent Structure and Vibration Control

View Preview

Info:

Periodical:

Applied Mechanics and Materials (Volume 160)

Pages:

3-7

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.160.3

Citation:

Cite this paper

Online since:

March 2012

Authors:

Wei Wei, Ping Yang, Qian Hong He, Quay Le Chen

Keywords:

Cooling Optimization, LED, Micro Projector, Thermal Analysis

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Ma Ze-tao, Zhu Da-qing, Wang Xiao-jun, in: Thermal Analysis of High power Light emitting Diode Packages, edtied by Semiconductor optoelectronics (2006).

Google Scholar

[2] Electronic industry standard of the People's Republic. SJ/T 11298 2003. Digital projector general specification, published by Ministry of information industry of the People's Republic of China(2004).

Google Scholar

[3] Chen Yu-hang, Han Xue, Li Shou-rong etc, in: Application of LED Light Source to Micro-projuection System, edited by OME information, Vol. 83-87 (2009), p.21.

Google Scholar

[4] Scott P Overman, in: Thermal Design Consideration for Portable DLP Projectors, Texas Instruments Incorporated (2001).

Google Scholar

[5] Zhou Jing-xian, Wu Rong-zhi, in: Digital Micromirror Device (DMD), edited by Chinese Journal of Liquid Crystals and Displays (2003).

Google Scholar

[6] Wang Jing, Wu Fu-gen, in: Key issues of improving cooling of high-brightness LED, edited by Electronic Design Engineering (2009).

Google Scholar

[7] Liu Yi-bing, Huang Xin-min, Liu Guo-hua, in: Research of Heat Release Technology of Based on Power-LED, edited by Zhaoming Gongcheng Xuebao (2008).

Google Scholar