Crack Analysis and Node Design Improvements for Polystyrene Outer Insulation System

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Abstract:

As a new composite wall system, because of advanced structure, excellent polystyrene insulation board, insulation effect, light weight, the simple and flexible construction method and well adaptability, polystyrene insulation board thin coating of exterior wall thermal insulation technology is widely used in China. In practical applications, thermal bridges and the board surface cracks that caused by improper handling of deformation joints and detailed structure are the main problem of the technology. In this paper, many problems are analyzed such as the crack causes, the plates overlap and the node structure treatment, and also corresponding solutions are proposed.

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1273-1276

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May 2012

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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[1] S.J Guan, J Ma, L.Q. Zhang and W.T. Li: China Academy of Building Research Vo29 (2011), p.74

Google Scholar

[2] S.Q. Zhao: Jiangsu Construction Vol. 119 (2008), p.53

Google Scholar

[3] J.D. Wei; X.H. Pan: Laigang Science & Technology Vol. 150 (2010), p.37

Google Scholar