Tailoring of Thermal Transition Temperature and Toughening of Shape Memory Epoxy Polymer

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Shape memory epoxy polymer (SMEP-1) was modified by introducing flexible epoxy into existing resin system. The thermal transition temperature (Ttrans) of shape memory polymer was tailored from 100°C to 76°C with the increase of the weight fraction of the flexible epoxy. The toughness of the polymer was also measured at the same time. The results show that the toughness of the polymer was improved especially at ultralow temperature. The addition of the flexible epoxy didn’t affect the excellent shape memory properties of the polymers.

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93-98

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June 2012

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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