Curing Kinetics of Phenol Formaldehyde Resin Modified with Sodium Silicate

Abstract:

The curing kinetics of PF resin modified with sodium silicate had been investigated by differential scanning calorimetry (DSC). The kinetic analysis was performed at heating rates of 5, 10, 15, and 20°C/min，respectively. The kinetic parameters such as reaction order and activation energy were solved by Kissinger and Crane equation. The relationship between curing temperature and heating rate was also investigated. The activation energy and the curing reaction order，which were obtained by kinetic calculation, are 83.00kJ/mol and 0.917, respectively. The curing reaction kinetics equations were built by the obtained best curing temperature, reaction order, pre-exponential factor and reaction rate constant.

• Periodical: Applied Mechanics and Materials (Volumes 184-185)
• Pages: 1471-1479
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.184-185.1471
• Online since: June 2012
• Authors: Jin Sun, Xiao Feng Zhu, Xiao Bo Wang, Rui Hang Lin, Zhen Zhong Gao
• Keywords: Curing, DSC, Kinetic, PF Resin, Sodium Silicate

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