[1]
Susann Zahn, Yvonne Schneider and Harald Rohm: Innovative Food Science and Emerging Technologies Vol. 7 (2006), p.288–293
Google Scholar
[2]
G. Sinn, B. Zettl, H. Mayer, S. Stanzl-Tschegg: Journal of Materials Processing Technology Vol. 170 (2005), p.42–49
DOI: 10.1016/j.jmatprotec.2005.04.076
Google Scholar
[3]
J. Rimkevičienė, V. Ostaševičius, V. Jūrėnas, R.Gaidys: MECHANIKA Vol. 1(2009), 1(75).
Google Scholar
[4]
Reimund Neugebauer, Andrea Stoll: Journal of Materials Processing Technology Vol. 149 (2004), p.633–639
Google Scholar
[5]
G. Arnold, L. Leiteritz, S. Zahn, H. Rohm: International Dairy Journal Vol.19 (2009), p.314–320
Google Scholar
[6]
M. Robiony, F. Polini1, F. Costa1, N. Zerman and M. Politi: Int. J. Oral Maxillofac. Surg. Vol. 36 (2007), p.267–269
Google Scholar
[7]
Y. Q. Guo and L. Y. Zhang: Modern Machinery Vol.6 (2008), pp.44-46
Google Scholar
[8]
J. Q. Liu, J. C. Yan and S. Q. Yang: Journal of Harbin Institute of Technology Vol.33 (2001), pp.435-438
Google Scholar
[9]
Andrea Cardoni, Margaret Lucas , Matthew Cartmell and Fannon Lim: Ultrasonics Vol. 42 (2004), p.69–74
Google Scholar
[10]
Chandra Nath, M. Rahman, S.S.K. Andrew: Journal of Materials Processing Technology Vol. 192–193 (2007), p.159–165
Google Scholar
[11]
Georg Eggers, Johannes Klein, Julia Blank, Stefan Hassfeld: British Journal of Oral and Maxillofacial Surgery Vol. 42 (2004), p.451—453
DOI: 10.1016/j.bjoms.2004.04.006
Google Scholar
[12]
Jongbaeg Kim, Bongwon Jeong, Mu Chiao, and Liwei Lin: IEEE TRANSACTIONS ON ADVANCED PACKAGING Vol.32 (2009), pp.461-467
DOI: 10.1109/tadvp.2008.2009927
Google Scholar
[13]
S.-F. Ling,X. Li,Z. Sun: ASME International Mechanical Engineering Congress and Exposition,(2007)
Google Scholar
[14]
Misugi Hongoh, Masafumi Yoshikuni, Hiroyuki Miura, Tetsugi Ueoka, Jiromaru Tsujino: 2004 IEEE International Ultrasonics, Ferroelectrics and Frequency Control Joint 50th Anniversary Conference pp.2326-2329
DOI: 10.1109/ultsym.2005.1602949
Google Scholar
[15]
Yoshitaka Nishimura, Kazumasa Kido, Fumihiko Momose and Tomoaki Goto: Proceedings of The 22nd International Symposium on Power Semiconductor Devices & ICs, Hiroshima pp.293-296
Google Scholar