For Libraries For Publication Open Access Downloads About Us Contact Us
Paper Titles
Effect of Ca and Rare Earths on Compressive Creep Behavior of Mg-4Al Alloy
p.457
Effect of Mortar Joint Thickness on the Compressive Strength of Autoclaved Flyash - Lime Brick Masonry
p.462
Effect of Particle Size Distribution on the Properties of Sand Mold by Three Dimensional Printing
p.467
Electroless Deposition of Silver Layer on Atomic-Layer-Deposited TiN
p.471
Electroless Deposition of Silver Layer on Silicon of High Density Plasma Bombarment
p.474
Flow Stress Behavior Anisotropy of Extruded 7075 Aluminum Alloy Bar at Elevated Temperatures
p.478
Fractal Characteristics of the Pore Structure of Low Permeability Sandstone
p.482
Fracture Behavior of a Brittle Thin Film on an Elastic Substrate under Residual Stress and Uniaxial Tensile Loading
p.487
Green Preparation of Ultra-Fine Silver Particles in Ionic Liquid
p.491

Electroless Deposition of Silver Layer on Silicon of High Density Plasma Bombarment

Article Preview

Abstract:

Electroless silver film was deposited on the Ti/Si substrate which was suffered from plasma bombardment to modify its surface chemistry. The surface tension of the Ti/Si surface was found to be reduced after plasma bombardment. After thermal annealing, the silver film was smoothened and showed a fine microstructure. However, the recrystal at high temperature annealing facilitated an increase of sheet resistance instaneously.

You might also be interested in these eBooks
Digital Manufacturing & Automation III View Preview

Info:

Periodical:

Applied Mechanics and Materials (Volumes 190-191)

Pages:

474-477

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.190-191.474

Citation:

Cite this paper

Online since:

July 2012

Authors:

Yuan Gee Lee

Keywords:

Electroless Silver, Plasma Bombardment, Sheet Resistance, Surface Tension

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] H. Luo, L. Sun,Y. Lu, and Y. Yan, Langmuir, Vol. 20 (2004), p.10218.

Google Scholar

[2] C.C. Young, J.G. Duh and C.S. Huang, Surface and Coatings Technology, Vol. 145 (2001), p.215.

Google Scholar

[3] H.D. Tonga, A.H.J. vanden Berga, J.G.E. Gardeniersa, H.V. Jansena, F.C. Gielensb and M.C. Elwenspoek, Thin Solid Films, Vol. 479 (2005), p.89.

Google Scholar

[4] J.H. Byeon, B.J. Ko, and J. Hwang, J. Phys. Chem. C, Vol. 112 (2008), p.3627.

Google Scholar

[5] L.A. Porter, Jr., H.C. Choi, J.M. Schmeltzer, Al.E. Ribbe, L.C.C. Elliott, and J.M. Buriak, Nano Letters, Vol. 2 (2002), p.1369.

Google Scholar

© 2025 Trans Tech Publications Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For open access content, terms of the Creative Commons licensing CC-BY are applied.
Scientific.Net is a registered trademark of Trans Tech Publications Ltd.