Experimental Study on Heat Pipe Radiator in Cooling Electronic Apparatus

Article Preview

Abstract:

To solve the cooling problem in modern electronic device, a kind of heat pipe radiator was designed and manufactured in this paper. The heat transfer performance of heat pipe radiator and its relationship with air velocity were investigated by experimental method. The experimental results show that the heat pipe radiator can meet the temperature requirement of electronic device with the power range from 40W to 160W. To keep the operational temperature of electronic device with power of 160W under 75°C,the air velocity should be keep at 1.7m/s. The heat dissipation performance of heat pipe radiator was enhanced with the air velocity increased from 0.2m/s to 1.7m/s.for the electronic equipment with power of 160W.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

216-220

Citation:

Online since:

September 2012

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] R.J. McGlen, R. Jachuck, S. Lin, Integrated Thermal Management Techniques for High Power Electronic Devices, Applied Thermal Engneering, 2004 (24) 1143-1156.

DOI: 10.1016/j.applthermaleng.2003.12.029

Google Scholar

[2] S.V. Garimella, Advances in Mesoscale Thermal Management Technologies for Microelectronics, Microelectronics J., 2006 (37) 1165-1185.

DOI: 10.1016/j.mejo.2005.07.017

Google Scholar

[3] HUANG Dage, YANG Shuanggen, Cooling Technique for High Flux Electronic [J]. Fluid Machinery, 2006, 34(9): 71-74.

Google Scholar

[4] ZHOU Genming, ZHOU Yan, MA Zheshu, Experiment Research on Heat Transfer of Aclinic Deeply-putted and High Efficient Heat Pipe [J]. Journal of Jiangsu University of Science and Technology (Natural Science Edition), 2008, 22(1): 69-72.

Google Scholar

[5] S.J. Kim, J.K. Seo, K.H. Do, Analytical and Experimental Investigation on the Operational Characteristics and the Thermal Optimization of a Miniature Heat Pipe with a Grooved Wick Structure, Int. J. Heat Mass Transfer, 2003 (46) 2051-(2063).

DOI: 10.1016/s0017-9310(02)00504-5

Google Scholar

[6] S.H. Moon, G. Hwang, H.G. Yun, T.G. Choy, Y. Kang, Improving Thermal Performance of Miniature Heat Pipe for Notebook PC Cooling, Microelectronics Reliability, 2001 (42) 135-140.

DOI: 10.1016/s0026-2714(01)00226-8

Google Scholar

[7] L.L. Vasiliev, Micro and Miniature Heat Pipes Electronic Component Coolers, Applied Thermal Engneering, 2008 (28) 266-273.

DOI: 10.1016/j.applthermaleng.2006.02.023

Google Scholar

[8] F.C. Possamai, I. Setter, L.L. Vasiliev, Miniature Heat Pipes as Compressor Cooling Devices, Applied Thermal Engneering, 29 (2009) 3218-3223.

DOI: 10.1016/j.applthermaleng.2009.04.030

Google Scholar