Study on the Effect of Slurry Formulation and Printing Process on HTCC Resistance

Ying Pei Liu; Xue Wang; Ling Ge Huang

doi:10.4028/www.scientific.net/AMM.200.655

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 200Study on the Effect of Slurry Formulation and...

Study on the Effect of Slurry Formulation and Printing Process on HTCC Resistance

Abstract:

Slurry formulation and printing process determine resistance and heating properties of HTCC, which directly affect the performance of the product. In this paper, through a large number of experiments , we found when the tungsten powder size in slurry formulation was 1-2μm , the flatness and adhesion of substrate were best , and that printing slurry weight and resistance of HTCC were inversely related. In addition,the printing process,such as printing pressure,the shape and angle of blade had effects on the resistance of HTCC.