Effect of Bamboo Powder on Curing Behaviors of Liquefied Bamboo-Based Resol Resin

Article Preview

Abstract:

Differential Thermal Analysis(DTA) and Differential scanning calorimetry (DSC) were used to study the effect of Bamboo Powder(BP) on the curing behavior of two types of liquefied bamboo-based resol resin(PBF). DTA analysis shows that the addition of bamboo powder to the PBF resin leads to low temperature and broad peaks in the DTA curves. It also accelerates the addition reaction in the curing process of PBF resin and reduced the peak temperature, activation energies for PBF resin . Bamboo Powder reduced the activation energies for resins because the bamboo powder maybe had selfcatalysis effect. The lowest activation energy for a PBF resin probably appeared about at pH 11.0 under alkaline conditions.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

3914-3919

Citation:

Online since:

October 2012

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] F. R. Huang, Y . S. Jiao. Phenolic Resins and the Application[M]. Beijing: Chemical Industry Press,2003.

Google Scholar

[2] Chow.S. Morphologic accessibility of wood adhesives [J].Journal of Applied Polymer Science, 1974, 18(9): 2785-2796.

DOI: 10.1002/app.1974.070180919

Google Scholar

[3] Pizzi A,Mtsweni B, Parsons W.Wood-induced catalytic activation of PF adhesives autopolymerization vs PF wood covalent bonding[J]. Journal of Applied Polymer Science, 1994, 52 (13): 1847-1856.

DOI: 10.1002/app.1994.070521302

Google Scholar

[4] JI Qing-juan, LIU Sheng-ping, LIU Min, et al. Curing Behaviors for Phenolic Resin/Wood Flour System[J]. Polymer Materials Science And Engineering, 2008, 24(3): 41-43.

Google Scholar

[5] He G B, Yan N.Effect of wood on the curing behavior of commercial phenolic resin systems[J].Journal of Applied Polymer Science, 2005, 95: 185-192.

DOI: 10.1002/app.21115

Google Scholar

[6] He G.B,Riedl B. Curing kinetics of phenol formaldehyde resin and wood-resin interactions in the presence of wood substrates[J]. Wood Sci Technol, 2004, 38:69.

DOI: 10.1007/s00226-003-0221-5

Google Scholar

[7] FU Shen-yuan, MA Ling-fei, LI Wen-zhu.Studies on Liquefaction of Bamboo And Properties Of Liquefied-Bamboo Adhesives[J]. Chemistry and Industry of Forest Products, 2004, 24(3): 43.

Google Scholar

[8] KISSINGER H E. Reaction kinetics in differential thermal analysis [J]. AnalyticalChemistry, 1957, 29: 1702-1706.

Google Scholar

[9] OZAWA T. Kinetic analysis of derivative curves in themal analysis [J]. Journal of Thermal Analysis, 1970, (2): 301-324.

DOI: 10.1007/bf01911411

Google Scholar

[10] Liu Xiaohuan, Fu shenyuan ,Zong enmin. Curing kinetics of liquified bamboo-based phenolic resin/bamboo powder system[J]. Thermosetting Resin, 2011, 26(3):7-9.

Google Scholar

[11] Ma Yuchun, Meng Qingrong, Zhang Liucheng. Curing Kinetics for AEN and BMD[J]. Polymer Materials Science And Engineering, 2008, 24(9): 120-122.

Google Scholar

[12] Li Ning ning, Wang Tingwei. Effects of aluminium on cure kinetics of novolac epoxy systems[J]. Journal of Harbin Engineering University, 2010, 31(11): 1541-1543.

Google Scholar

[13] LIU Jingru, LUO Yunjun. Curing Kinetics of HTPB /TDI/Al System by Non-isothermal DSC[J]. Chinese Journal of Energetic Materials,2009, 17(1): 84

Google Scholar

[14] Byung-Dae Park,Bernard Ried, Ernest W. Hsu, Jack Shields. Differential scanning calorimetry of phenolic formaldehyde resins cure-accelerated by carbonates[J]. Polymer, 1999, 40: 1689-1699.

DOI: 10.1016/s0032-3861(98)00400-5

Google Scholar