Optimization of Processing Parameters for Electrolysis and Plasma Polishing

Ji Wang; Lai Chun Suo; Li Li Guan; Yi Li Fu

doi:10.4028/www.scientific.net/AMM.217-219.1368

Paper Titles

Microstructure and Wear Resistance of Laser Cladding Nano-Al₂O₃/MCrAlY Composite Graded Coating on TiAl Alloy
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Microstructure and Wear Properties of Laser Synthesized Composite Coatings on Ti-6Al-4V
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Investigation on the Interfacial Bonding Strength between Ni-P-W/Al₂O₃ Composite Coatings and NdFeB Matrix
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Synthesis and Evaluation of Anionic Gemini Surfactant
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Optimization of Processing Parameters for Electrolysis and Plasma Polishing
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Springback Prediction Using the Split-Ring Test Based on a Combined Anisotropic Hardening Model
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Modeling and Movement Simulation of the Interior Transmission Mechanism of the Hoist Based on ProE
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Reliability Optimization Design Based on the Blind Number Theory
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Numerical Simulation of Compressive Experiment for Rock with a Natural Interlayer
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 217-219Optimization of Processing Parameters for...

Optimization of Processing Parameters for Electrolysis and Plasma Polishing

Abstract:

To study influence of temperature and concentration of the polishing solution and the workpiece’s diving depth and spatial orientation in the polishing solution on electrolysis and plasma polishing, orthogonal experiments consisting of four factors at four different levels were performed by using surface roughness of the specimen after 5 minutes of polishing and electric current density in the process of the polishing as experimental indexs based on the polishing mechanism and the mathematic model of surface roughness with polishing time. Primary and secondary order and regularity of the factors affecting the roughness and the electric current density are obtained by means of extreme difference method combined with variance analytic method. Optimal parameter combination focusing on the polishing effects or considering fully the polishing effects, cost and efficiency is proposed.