Numerical Simulation on the Influence of Heated Mold Continuous Casting Process Parameters to Solid-Liquid Interface

Hong Jin Zhao; Gui Huan An; Wen Feng Zeng; Xin Luo

doi:10.4028/www.scientific.net/AMM.217-219.2006

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 217-219Numerical Simulation on the Influence of Heated...

Numerical Simulation on the Influence of Heated Mold Continuous Casting Process Parameters to Solid-Liquid Interface

Abstract:

The effect of the position and shape of solid-liquid interface on process parameters has been studied by the numerical simulation method, and the reasonable process parameters have been given. The results shows that the position and shape of solid-liquid interface is mainly affected by mold temperature, casting speed and cooling distance. It were moved to the mold export with the improvement of the mold temperature, casting speed or the reduce of cooling capacity. And the reasonable process parameters are that the mold temperature is 1363-1373 K, casting speed is 80-100mm/min, cooling distance is 40-50mm. The research results would obtain stable operation conditions and improve the billet quality.

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Periodical:

Applied Mechanics and Materials (Volumes 217-219)

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2006-2011

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https://doi.org/10.4028/www.scientific.net/AMM.217-219.2006

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Online since:

November 2012

Authors:

Hong Jin Zhao*, Gui Huan An, Wen Feng Zeng, Xin Luo

Keywords:

Heated Mold Continuous Casting, Numerical Simulation, Single Crystal Copper, Solid-Liquid Interface

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