Study on Thinning of a Boron-Doped Polycrystalline Diamond Wheel-Tool by Micro Rotary W-EDM Approach

Shun Tong Chen; Chih Hsien Chang

doi:10.4028/www.scientific.net/AMM.217-219.2167

Paper Titles

An Optimization Design for Coefficient of Weld Reinforcement in Rapid Prototyping Based on Robotic Pulse MAG Forming
p.2148

Numerical Study of Transverse Impact Response of Single-Lap Adhesively Bonded Joint
p.2154

Finite Element Analysis of the Combined Effect of Strain Hardening and Friction in Elementary Processes of Forging
p.2159

Study on Machining Characteristics of Ultrasonic Vibration Assisted Micro-EDM
p.2163

Study on Thinning of a Boron-Doped Polycrystalline Diamond Wheel-Tool by Micro Rotary W-EDM Approach
p.2167

Analysis of Main Optimization Techniques in Predicting Surface Roughness in Metal Cutting Processes
p.2171

Robust Process Design towards through-Silicon via Quality Improvement Based on Grey-Taguchi Method
p.2183

Investigation of Vibration and Surface Roughness in Micro Milling of PMMA
p.2187

Overviews of the Behavior of Heat Transfer of Soft-Contact Electromagnetic Continuous Casting Mold
p.2194

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 217-219Study on Thinning of a Boron-Doped Polycrystalline...

Study on Thinning of a Boron-Doped Polycrystalline Diamond Wheel-Tool by Micro Rotary W-EDM Approach

Abstract:

This study presents a novel approach for using a micro rotary wire Electrical Discharge Machining (micro w-EDM) to thin the grinding-edge of a wheel-tool made from boron-doped polycrystalline composite diamond (PCD). For thinning the PCD, two discharge circuits (a Resistance-Capacitance (RC) circuit and a transistor) were used as power sources to obtain a grinding-edge of less than 10 µm in thickness and high surface quality. The wheel-blank is vertically mounted on a spindle and while rotating is thinned by micro w-EDM along a planned computer numerically controlled path. Experimental results verify that boron-doped PCD can be successfully thinned down to 5 µm in edge-thickness. The study shows it is possible to break (cut) diamonds of 10-µm grain size, leaving smooth surface-exposed diamonds at the cutting edge of the wheel tool. The dimensional and geometrical accuracy of the wheel-tool can be exactly controlled. Raman analysis reveals graphitizing of the PCD caused by local high temperature spark erosion at a peak of 1593 cm^-1 in RC discharge circuit machining. The peak at 1332 cm^-1 for the transistor circuit method indicates diamond sp3 structure. The surface degenerating layer produced by transistor circuit machining gives a suitably thin grinding edge with exposed diamond grains.