Robust Process Design towards through-Silicon via Quality Improvement Based on Grey-Taguchi Method

Abstract:

The robust design of chemical etching parameters is dealing with the optimization of the through-silicon via (TSV) roundness error and TSV lateral etching depth in the etching of silicon for laser drilled TSVs. The considered wet chemical etching parameters comprise the HNO₃ molarity, HF molarity, and etching time. Grey-Taguchi method is combining the orthogonal array design of experiments with Grey relational analysis (GRA), which enables the determination of the optimal combination of wet chemical etching parameters for multiple process responses. The concept of Grey relational analysis is to find a Grey relational grade, which can be used for the optimization conversion from a multiple objective case to a single objective case. Also, GRG is used to investigate the parameter effects to the overall quality targets.

• Periodical: Applied Mechanics and Materials (Volumes 217-219)
• Pages: 2183-2186
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.217-219.2183
• Online since: November 2012
• Authors: Chao Wei Tang, Li Chang Chuang, Hong Tsu Young, Mike Yang, Hsueh Chuan Liao
• Keywords: Chemical Etching, Grey-Taguchi, Optimization, Robust Design

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