Study of Signal Transmission for SIP and POP

Abstract:

With the electronic toward miniaturization and multifunctional development, such as System-in-Package (SIP), Package-on-Package (POP), these packages have been widely used. Signal speeds increase and then require that signal has a good transmission quality. Therefore the design of signal integrity should take into account these issues from the beginning design. In this paper, a model about the wire bonding transmission problem between the upper and lower levels of chip is proposed. The simulation results are shown at the different height and radius of the equivalent model. Meanwhile, researching in different cases, noise interference source makes the influence on signal quality. Finally, by adding the signal return path, signal integrity is achieved well by the eye diagram analysis.

• Periodical: Applied Mechanics and Materials (Volumes 220-223)
• Pages: 2297-2300
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.220-223.2297
• Online since: November 2012
• Authors: Ling Feng Shi, Cheng Shan Cai, Yuan Ming Xiao, Li Ye Cheng, Chen Meng, Xin Quan Lai
• Keywords: Insertion Loss, Package-on-Package (POP), Return Path, Signal Integrity (SI)

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