Design of LED Integrated Package Devices

Abstract:

To solve the technical problem of LED chips with top and back electrodes can only forms parallel connection; this paper provided integrated packaging structure by using silver reflective layers, aluminium oxide and aluminum plate. LED chips with top and back electrodes, according to a certain permutations and combinations way, were packaged integrally on the independent silver reflective layers. The silver reflective layers were on the aluminum plate with aluminium oxide insulating layer. Studies show that when the LED chips with top and back electrodes packaged on aluminum plate with aluminium oxide insulating layer are easier to achieve parallel and series connection. Moreover, the LED integrated package devices has higher driving voltage and lower driving current than traditional LED integrated package devices with top and back electrodes. In addition, independent silver reflective layers can provide integrated package devices with a better luminous efficiency.

• Periodical: Applied Mechanics and Materials (Volumes 246-247)
• Pages: 1154-1157
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.246-247.1154
• Online since: December 2012
• Authors: Ying Jiang, Zhi Hua Xiong, Qian Xiang
• Keywords: Aluminium Oxide, Aluminum Plate, Back Electrodes, Integrated Packaging, Silver Reflective Layers, Top Electrodes

References

[1] Huang B J and Tang C W: 2009 Applied Thermal Engineering Vol. 29 (2009), P. 3366-3373.

[2] Chen Z H, Zhang Q and Chen R 2011 ECTC, 2011 IEEE 61st Lake Buena Vista, FL, (2011).

[3] OUYANG X Q, WANG S X and Zheng Q N: Electronics&Packaging Vol. 11 (2011), pp.1-4.

[4] Tian C J, Zhang X Y and Zou J: Chin. J. Lumin. Vol. 1 (2010) pp.96-99.

[5] Gao H J, Yu L Y and Niu P J: Advanced Materials Research Vol. 301-303 (2011), pp.208-212.

[6] Rao F, Ge Z C and Zhu J L: Advanced Materials Research Vol. 347-353 (2011), pp.310-313.

[7] Wang D M, Chen S H, Wang M and Xiang S H : 7th International Conference on Electronic Packaging Technology (2006) pp.1-3.

[8] M. M Wan, J. W Gu: Analysis on data format of AutoCAD Graph. Engineering Graphics Journal Vol. 1 (2004).

[9] Q. N Xiao: Implement on reading and writing of DWG files based on DWGDirectX. Computer System Application Vol. 4 (2009).

[10] Y. Yan, C. Xu: Access to AutoCAD's DWG file based on DWGDirect. Engineering Graphics Journal Vol. 6 (2010).

[11] Wang K, Mao Z M, Liu Z Y, Chen F, Chen H, Luo X B and Liu S: Proceedings - Electronic Components and Technology Conference (2010) pp.686-692.

[12] Chen K W, Zhang R and Lee. S.W. R: Proceedings - 11th International Conference on Electronic Packaging Technology and High Density Packaging (2010) pp.1386-1392.

[13] Liu C K, Dai M J, Yu C K and Kuo S L: International Micro-systems, Packaging, Assembly and Circuits Technology Conference (2007) pp.29-33.