Sintering Characteristics of Micro-Zn Paste Containing Sn-3.0Ag-0.5Cu Nanoparticles

Sang Soo Chee; Jong Hyun Lee

doi:10.4028/www.scientific.net/AMM.249-250.939

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 249-250Sintering Characteristics of Micro-Zn Paste...

Sintering Characteristics of Micro-Zn Paste Containing Sn-3.0Ag-0.5Cu Nanoparticles

Abstract:

The transient liquid-phase sintering behavior of micro-Zn/nano-Sn-3.0Ag-0.5Cu (SAC) pastes was examined at a temperature of 190 °C as a function of the volume of ultrafine (~12.4 nm) SAC nanoparticles present. SAC nanoparticles have lower melting point drop than the bulk SAC particles. Although successful linkage at the interface between all Zn particles was not accomplished in all sintered samples, the number of linkages increased marginally with a decrease in the SAC content. As a result, the electrical resistivity of the sintered samples decreased with the decrease in the SAC content; however, the resistivities were still very high in all samples. Microstructural observations indicated that the observed results were mainly due to the short lifespan of the liquid phase caused by the coarsening of SAC nanoparticles during heating.

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Periodical:

Applied Mechanics and Materials (Volumes 249-250)

Pages:

939-944

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.249-250.939

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Online since:

December 2012

Authors:

Sang Soo Chee, Jong Hyun Lee

Keywords:

Electrical Resistivity, Liquid-Phase Sintering, Melting Point, Micro-Zn Paste, Sn-3.0Ag-0.5Cu Nanoparticle

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