Preparation of RPSL-02 Type Photosensitive Resin for Stereolithography Material and Investigation on its some Properties

Bi Wu Huang; Kuan Zhou; Chong Deng; Wei Qing Chen

doi:10.4028/www.scientific.net/AMM.252.224

Paper Titles

Research on Coal Mining Material Active Perception System Based on IOT and Coal Resources
p.207

Enhanced the Dielectric and Tunable Properties of BZNT Thin Films through Adjusting Annealing Process
p.211

Photoelectrochemical Studies of Dye-Sensitized TiO₂ Nanoporous Electrodes
p.216

Investigation on some Properties of Renshape^TMSL7545 Type Photosensitive Resin and its Application for Stereolithography Material
p.220

Preparation of RPSL-02 Type Photosensitive Resin for Stereolithography Material and Investigation on its some Properties
p.224

Enhanced Removal of Phenol by a Hyper-Cross-Linked Resin Functionalized with Composite Properties of Chemical Materials
p.228

Enhanced Dielectric Properties of Pb_0.3Sr_0.7TiO₃ Thin Films by Ultrasonic Processing
p.232

A Prototype of Electrostatic Membrane Reflector with Composite Properties of Membrane Material
p.237

Electrostatic-Structure Couple Field Analysis in Electrode Plate Design of Electrostatic Membrane Reflector with Composite Properties of Membrane Material
p.241

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 252Preparation of RPSL-02 Type Photosensitive Resin...

Preparation of RPSL-02 Type Photosensitive Resin for Stereolithography Material and Investigation on its some Properties

Abstract:

RPSL-02 type photosensitive resin for stereolithography material was prepared with 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate (UVR 6110), bisphenol A type epoxy diacrylate (EA-612), trimethyolpropane triacrylate (TMPTA), polycaprolactone polyol (polyol-0301), triethylene glycol divinyl ether (DVE-3), benzil dimethyl ketal (Irgacure651) and a mixture of triarylsulfonium hexafluoroantimonate salts (UVI-6976) as raw materials. Some properties of the photosensitive resin were investigated. The viscosity of the photosensitive resin at 30°C was 395mPa.S, The glass transition temperature (Tg ) of the UV-cured specimen was 52°C, and the weight loss of the UV-cured specimen at 200°C was less than 5%. The photosensitive resin and its UV-cured specimen were also characterized by infrared (IR).

You might also be interested in these eBooks

Advanced Research on Applied Mechanics and Manufacturing System

View Preview

Info:

Periodical:

Applied Mechanics and Materials (Volume 252)

Pages:

224-227

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.252.224

Citation:

Cite this paper

Online since:

December 2012

Authors:

Bi Wu Huang, Kuan Zhou, Chong Deng, Wei Qing Chen

Keywords:

Photosensitive Resin, Preparation, Property, Stereolithography Material

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] D.E. Karalekas and A. Agelopoulos: Materials and Design Vol. 27 (2006), p.100.

Google Scholar

[2] Dickens PM: J. Eng. Manuf. Vol. 209 (1995), p.261.

Google Scholar

[3] Biwu Huang, Zixiang Weng, Shimin Liu and Weiqing Chen: Advanced Materials Research Vols. 287-290 (2011), p.386.

Google Scholar

[4] Biwu Huang and Mingyi Chen: Applied Mechanics and Materials Vols. 117 -119 (2012), p.1164.

Google Scholar

[5] Karalekas D and Aggelopoulos: J. Mater. Process. Tech. Vol. 136 ( 2003), p.146.

Google Scholar

[6] Biwu Huang, Zixiang Weng and Wei Sun: Advanced Materials Research Vols. 233-235 (2011), p.194.

Google Scholar

[7] G.V. Salmoria, C.H. Ahrens and V.E. Beal: Materials and Design Vol. 30 ( 2009), p.758.

Google Scholar

[8] Huang Biwu, Chen Weifan and Chen Weiqing: ACTA OPTICA SINICA Vol. 28 (2008), p.2354 ( In Chinese).

Google Scholar

[9] G.V. Salmoria, P. Klauss, and A.T.N. Pires: Polymer Testing Vol. 27 (2008), p.698.

Google Scholar

[10] G.V. Salmoria, C.H. Ahrens and V.E. Beal: Materials and Design Vol. 30 ( 2009), p.758.

Google Scholar

[11] W.X. Zhou, in: Technologies of Determining Plastics, edited by Chemical Industry Press, Beijing (1997).

Google Scholar