Preparation of Cu NPs Suspension for Conductive Ink

Wen Bo Li; Li Xin Mo; Wei Wei Li; Xin Ming Fan; Jun Ran; Ji Lan Fu; Yan Fang Xu; Lu Hai Li

doi:10.4028/www.scientific.net/AMM.262.514

Paper Titles

Study of Edible Ink
p.497

A Nano-Silver Inkjet Conductive Ink with Excellent Adhesion
p.501

Effect of Solvent on the Property of the Infrared Absorbing Inkjet Ink
p.505

Effects of Fillers on the Transfer Properties of UV Waterless Offset Ink
p.510

Preparation of Cu NPs Suspension for Conductive Ink
p.514

Investigation on Factors Influencing Fluorescence Intensity of Red Fluorescent Inkjet Ink
p.518

Preparation of Water-Based Nano-Silver Gravure Conductive Ink Used for Printed Electronics
p.523

Study on the Dispersity of Black Water-Based Covering Ink
p.527

Modification of γ-Al₂O₃ as Ink-Jet Printing Paper Coating Pigment by Coupling Agents
p.532

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 262Preparation of Cu NPs Suspension for Conductive...

Preparation of Cu NPs Suspension for Conductive Ink

Abstract:

Copper nanoparticles (Cu NPs) have attracted tremendous interest in recent years in the field of printable electronics due to their low cost and high conductive properties. In this study, copper nanoparticles were synthesized via a polyol method by reducing cupric nitrate trihydrate with hydrazine hydrate in the presence of PVP as protective agent. Collide of Cu NPs was obtained after three times of sedimentation by acetone. Suspension for conductive ink was then prepared by adding some amount of solutions and additives followed by parameters adjusting. Sheet resistance of the Cu NPs films coated on a glass substrate could be reduced to 750 mΩ/□ after heating at 300°C for 1h in vacuum.