A Nano-Silver Inkjet Conductive Ink with Excellent Adhesion

Abstract:

In this paper，the preparation of a solvent based nano-silver inkjet conductive ink with excellent adhesion was investigated and applied. Nano-silver particles, with dodecylamine (DDA) as the protective agent, were prepared and the effect of protective agent on the post heat-treatment of nano- silver films was investigated. Results of electrical resistance, micro-structural evolution and thermal analysis showed that the Ag/DDA films require a relatively low treatment temperature to convert into conductive materials. Then the conductive ink was prepared with well dispersed Ag/DDA nanoparticles and the ink was printed patterns on PET、PI films through EPSON ME 33 inkjet printer , the patterns showed a sheet resistance is 182.3mΩ/□ and the adhesion reached to 5B after heat-treating at 120°C for 60min .

• Periodical: Applied Mechanics and Materials (Volume 262)
• Pages: 501-504
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.262.501
• Online since: December 2012
• Authors: Jun Ran, Li Xin Mo, Wen Bo Li, Wei Wei Li, Xin Ming Fan, Ji Lan Fu, Lu Hai Li
• Keywords: Adhesion, Conductive Ink, Nano-Silver, Resistance

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