Mechanical Shock Ability of Different Potting Materials and Packaging Processes for Electronic Components

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In the paper, the mechanical shock abilities of the three potting materials of hard material, silicone and paraffin wax for the ceramic packaging capacitors and metal packaging capacitors are investigated by mechanical shock tests. Results show that the mechanical shock resistance ability of the hard epoxy resin potting material is the strongest, and the mechanical shock resistance ability of the metal packaging component is more than the ceramic packaging. The mechanical shock resistance value of the epoxy resin potting material for metal packaging capacitors is in 20000g above.

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Edited by:

Wen-Pei Sung and Ran Chen

Pages:

50-54

Citation:

B. Pan et al., "Mechanical Shock Ability of Different Potting Materials and Packaging Processes for Electronic Components", Applied Mechanics and Materials, Vols. 271-272, pp. 50-54, 2013

Online since:

December 2012

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$38.00

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