Mechanical Shock Ability of Different Potting Materials and Packaging Processes for Electronic Components

Bo Pan; Yong Wang; Jing Min Jin; Lin Wang; Mao Dong Ma

doi:10.4028/www.scientific.net/AMM.271-272.50

Paper Titles

Analysis of Forging Forming of 6061 Aluminum Alloy Bicycle Pedal
p.31

Effects of Cu and Zr on the Formation and Thermal Stability of Al–Ni–Zr–Cu–Y Amorphous Alloy
p.36

Isothermal Crystallization of Polyethylene/Montmorillonite Nanocomposites Prepared by In Situ Polymerization
p.42

Characterization of Graphite Containing Ceramic Coating Prepared on Carbon Steel by Plasma Electrolytic Oxidation
p.46

Mechanical Shock Ability of Different Potting Materials and Packaging Processes for Electronic Components
p.50

Luminescence Properties of Inert Lanthanide Ion Doped Europium Complexes with 2-Pyrazinecarboxylic Acid and Butanedioic Acid
p.55

Analysis of Environmentally Friendly Packaging Materials in Modern Packaging Design
p.60

Study of Mechanical Properties and Fracture Mechanism of a New High-Temperature Alloys
p.64

Analysis of Glass Packing Materials in Packing Design
p.69

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 271-272Mechanical Shock Ability of Different Potting...

Mechanical Shock Ability of Different Potting Materials and Packaging Processes for Electronic Components

Abstract:

In the paper, the mechanical shock abilities of the three potting materials of hard material, silicone and paraffin wax for the ceramic packaging capacitors and metal packaging capacitors are investigated by mechanical shock tests. Results show that the mechanical shock resistance ability of the hard epoxy resin potting material is the strongest, and the mechanical shock resistance ability of the metal packaging component is more than the ceramic packaging. The mechanical shock resistance value of the epoxy resin potting material for metal packaging capacitors is in 20000g above.

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Periodical:

Applied Mechanics and Materials (Volumes 271-272)

Pages:

50-54

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.271-272.50

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Online since:

December 2012

Authors:

Bo Pan, Yong Wang, Jing Min Jin, Lin Wang, Mao Dong Ma

Keywords:

Ceramic Packaging, Mechanical Shock, Metal Packaging, Potting Materials

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