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Thermal Shock Behavior of a Functionally Graded Material Plate with a Crack

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Abstract:

A thermal shock problem of a functionally graded material plane (FGMP) containing a crack is considered. All the material properties of the FGMP are assumed to be dependent on the coordinates.The transient temperature fields are solved by combining the finite difference method (FDM) and the finite element method (FEM). Then the transient thermal stress intensity factors (TSIFs) are obtained using the interaction energy integral method. The transient characteristics of the TSIFs are investigated.

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Applied Mechanics and Materials I View Preview

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Periodical:

Applied Mechanics and Materials (Volumes 275-277)

Pages:

152-155

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.275-277.152

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Online since:

January 2013

Authors:

Yan Yan Zhang, Li Cheng Guo, Feng Nan Guo, Hong Jun Yu, Kai Huang, Yu Bo Feng

Keywords:

Finite Element Method (FEM), Functionally Graded Material (FGM), Thermal Shock, Transient Thermal Stress Intensity Factors

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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