Preparation and Properties of Carbon Nanotubes Reinforced Cu Matrix Composites for Electronic Packaging Application

Long Shan Xu; Xiao Hua Chen; Xing Jun Liu

doi:10.4028/www.scientific.net/AMM.275-277.1789

Paper Titles

Experimental Research on Mechanical Characteristics in the Process of Nanoscale Sliding Contact
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Synthesis and Characterization of Neodymium Zirconate Nanocrystals Doped with Aluminium Ions by a Salt-Assistant Combustion Method
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Morphology Transition of Diblock Copolymer with Nanoparticles Confined in Cylindrical Nanopores
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Dispersion of Multi-Walled Carbon Nanotubes Modified with Poly-L-Lysine in Water
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Preparation and Properties of Carbon Nanotubes Reinforced Cu Matrix Composites for Electronic Packaging Application
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Preparation and Characterization of Aligned Carbon Nanotube Fibers
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Fabrication of WO₃ with Macroscopic Structures via CNFs Template
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Computational Study of Thermal Stabilities of Cu Nanorods at Atomic Scale
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The Electrical Potential Distribution in the Hetero Structure during the Growth of the Electrodeposition Nano
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 275-277Preparation and Properties of Carbon Nanotubes...

Preparation and Properties of Carbon Nanotubes Reinforced Cu Matrix Composites for Electronic Packaging Application

Abstract:

Multi-walled carbon nanotube (MWCNT) reinforced copper nanocomposites were prepared using a unique spherical MWCNT-implanted copper composite powders. The MWCNTs are homogenously ‘locked’ in the composite and tightly bonded to the matrix, which makes them play excellent reinforcement role on the microhardness compared with the unreinforced pure copper. Although the thermal conductivity is not enhanced for the thermal resistance between the carbon nanotubes and the copper matrix; it is still high enough to be used as electronic packaging materials even the concentration of MWCNTS in the composite is up to 5 wt%. Furthermore, the thermal expansion of the composites decreased apparently with the addition of the carbon nanotubes.

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Periodical:

Applied Mechanics and Materials (Volumes 275-277)

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1789-1793

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.275-277.1789

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Online since:

January 2013

Authors:

Long Shan Xu, Xiao Hua Chen, Xing Jun Liu

Keywords:

Carbon Nanotube (CN), Composite, Electronic Packaging, Thermal Conductivity (TC), Thermal Expansion

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