Optimized Wire Bonding Process on Micro-Connection Pad with Ni/CeO2 Coatings

Chun Yu Wang; Qing Wang; Han Zhu Li; Xiao Zhi Ji; Zhi Long Kang

doi:10.4028/www.scientific.net/AMM.275-277.1925

Paper Titles

Study on the Critical Damage Value and Processing Map of AZ80 Magnesium Alloy Forming at Elevated Temperatures
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Mechanical Properties of WC-Co Cemented Carbide Prepared via Vacuum Sintering
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Preparation of Bromine Carbon Alkyd Resin Retardant Coatings for Steel Structure
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Optimized Wire Bonding Process on Micro-Connection Pad with Ni/CeO₂ Coatings
p.1925

Preparation and Hydrogen Storage Kinetics of Nanocrystalline and Amorphous Mg₂Ni-Type Alloys
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Preparation of Infrared Stealthy Coatings
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Investigation on the Optical Performance of Co and Al Co-Doping ZnO Films
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Properties of N-Doped ZnO Films by RF Magnetron Sputtering
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 275-277Optimized Wire Bonding Process on Micro-Connection...

Optimized Wire Bonding Process on Micro-Connection Pad with Ni/CeO₂ Coatings

Abstract:

Keywords: Electroless plating Ni, CeO2, Micro-connection pad, Wire bonding Abstract. It is Ni/CeO2 coatings that have been prepared on SiC/Al composites surfaces (electroless plating Ni and depositing CeO2 conversion coatings). It is employed to wire bonding process as a new micro-connection pad in this paper. During bonding process, ultrasonic time, ultrasonic power, bonding pressure, etc. have been investigated. The optimized parameters are obtained with the best bonding properties.

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Applied Mechanics and Materials (Volumes 275-277)

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1925-1928

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.275-277.1925

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Online since:

January 2013

Authors:

Chun Yu Wang, Qing Wang, Han Zhu Li, Xiao Zhi Ji, Zhi Long Kang

Keywords:

CeO₂, Electroless Plating Ni, Micro-Connection Pad, Wire Bonding

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