Experimental Investigation on Hybrid Technology of Ultrasonic Vibration Assisted Chemo-Mechanical Grinding (CMG) Silicon Wafer

Abstract:

For the final finishing of the substrate surface, Chemo-mechanical polishing (CMP) is often utilized. Those processes are able to offer a great sur-face roughness, but sacrifice profile accuracy. On the other hand, Chemo-mechanical grinding (CMG) is potentially emerging defect-free machining process which combines the advantages of CMP. In order to simultaneously achieve high surface quality and high profile accuracy, CMG process has been applied into machining of large size quartz glass substrates for photomask use. In this paper, based on the characteristics of higher machining efficiency and higher surface quality of ultrasonic vibration machining, a new ultrasonic vibration assisted CMG of silicon wafer hybrid technique is achieved by designing elliptical vibrator with longitudinal mode and bending mode. The experimental results show that under the elliptic ultrasonic vibration assistance, the surface roughness is decreased significantly, the surface quality is improved obviously, and moreover caused little or even doesn’t lead to the surface damage.

• Periodical: Applied Mechanics and Materials (Volumes 275-277)
• Pages: 2290-2294
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.275-277.2290
• Online since: January 2013
• Authors: Wei Ping Yang, Yong Bo Wu, Jun Liu
• Keywords: Chemical Mechanical Grinding (CMG), Hybrid, Silicon Wafer, Ultrasonic Vibration

References

[1] Imai M, Mayusumi M, Inoue K, et al. Issues for the larger diameter epitaxial wafer: submitted to Journal of Microelectronic Engineering (2001).

DOI: 10.1016/s0167-9317(00)00511-6

[2] Jianxiu Su, Renke Kang, Dongming Guo. Technology analysis of wafer chemical mechanical polishing in the manufacture of ULSI: submitted to Journal of Semiconductor Technology (2003) (In Chinese).

[3] J.H. Liu, Z.J. Pei, G.R. Fisher. Grinding wheels for manufacturing of silicon wafers: submitted to International Journal of Machine Tools and Manufacture (2007).

DOI: 10.1016/j.ijmachtools.2006.02.003

[4] L. Zhou, B.S. Hosseini, T. Tsuruga, et al. Fabrication and evaluation for extremely thin Si wafer: submitted to International Journal of Abrasive Technology (2007).

DOI: 10.1504/ijat.2007.013852

[5] D.M. Guo, Y.B. Tian, R.K. Kang, et al. Material removal mechanism of Chemo-Mechanical Grinding (CMG) of Si wafer by using Soft Abrasive Grinding Wheel: submitted to Journal of Key Engineering Materials (2009).

DOI: 10.4028/www.scientific.net/kem.389-390.459

[6] S. Kamiya, H. Iwase, K. Kishita, et al. Study on reaction mechanism of Si and pure CeO2 for chemical-mechanical-grinding (CMG) process: Proceeding of the 1st International Conference on Nano-manufacturing (2008).

[7] Kim J D, Choi I H. Micro surface phenomenon of ductile cutting in the ultrasonic vibration cutting of optical plastics: submitted to Journal of Materials Processing Technology (1997).

DOI: 10.1016/s0924-0136(96)02546-0

[8] Thoe T B, Aspinwall D K, Wise M L H. Review on Ultrasonic Machining: submitted to International Journal of Machine Tools Manufacture (1998).

DOI: 10.1016/s0890-6955(97)00036-9

[9] Deng J X, Lee T C. Effect of ultrasonic surface finishing on the strength and thermal shock behavior of the EDMed ceramic composite: submitted to International Journal of Machine Tools and Manufacture (2002).

DOI: 10.1016/s0890-6955(01)00109-2

[10] Hocheng H, Kuo K L. Fundamental study of ultrasonic polishing of mold steel: submitted to International Journal of Machine Tools and Manufacture (2002).

DOI: 10.1016/s0890-6955(01)00099-2

[11] Taniguchi N: Nanotechnology. Oxford University Press (1996).

[12] Weiping Yang, Jiawen Xu. Measurement of material micro remove rate with roughness measuring instrument: submitted to Journal of Tool Engineering (2007) (In Chinese).