Present Research Situation and New Trends of Electroforming

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The basic principle and technological methods of electroforming are briefly described. With the progress in materials, processes and equipment, electroforming has got a considerable development. It is increasingly combined with other technologies, such as assembling electrotype, fabrication of MEMS, LIGA, etc. The shortcomings of electroforming technologies at present stage are also pointed out. As an inter-disciplinary subject area, electroforming will be widely developed and applied.

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401-405

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January 2013

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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[1] Tsao C C, Sachs E. Photo-el ectroforming: 3-D geometryan dmaterials flexibility in a MEMS fabrication process [ J ] . Journal of Microelectromechanical Systems, 1999, 8( 2) : 161-171.

DOI: 10.1109/84.767112

Google Scholar

[2] He Z, Zhou J , Tseng A. Feasibility study of chemical liquid deposition based solid freeform fabrication[ J ] . Materials and Design, 2000, 21( 2) : 83-92.

DOI: 10.1016/s0261-3069(99)00062-x

Google Scholar

[3] Zhen-mi Tu, Theo. and tech. of electroplating alloy [A].China National Defe. Industry Press.1995.

Google Scholar

[4] Ali Karpuza, Hakan Kockara, Mursel Alperb, et al. Applied Surface Sci.258 (2012) 4005-4010.

Google Scholar

[5] C. Lupia, A. Dell'Erab, M. Pasqualic et al. Surface &Coatings Technology (2011)205:5394-5399.

Google Scholar

[6] C.K. Chung, W.T. Chang, M.W.liao. Thin Solid Films 519(2011)2075-2078.

Google Scholar

[7] O.Ergeneman, K.M. Sivaraman, S.Pane et al. Electrochimica Acta 56(2011)1399-1408.

Google Scholar

[8] M.Srivastava, V.Ezhil Selvi V.K. William.et al. Surface & Coatings Tech.201(2006)3051- 3060.

DOI: 10.1016/j.surfcoat.2006.06.017

Google Scholar

[9] C.K. Chung, R.X. Zhou, W.T. Chang. Microsystem Technology (2008) 14:1279-1284.

Google Scholar

[10] D.F. Yang, H.Z.P., GuoL.Z. et.al. Electroplating & Pollut. Control.vol.30:5-7.(2010).In Chinese.

Google Scholar