Design and Simulation of Laser Module Packaging of TO-Based Butterfly-Type Structures

Abstract:

A novel design of butterfly-type laser module packaging using transistor outline (TO) structures is proposed. The cost down and fabrication time savings for fabrication of the module packagings are obtained, and the yield rate and the coupling efficiency of butterfly-type laser module are enhanced. The post-weld-shift (PWS) correction uses laser hammer technique in coaxial-type laser modules is studied experimentally and numerically. Experimental results show that the PWS of a coaxial laser module welded by a three-beam laser system can be corrected by applying laser hammer on the opposed tilt direction of welded components to realign the fiber back closer to its optimum position. In addition, the coupling efficiency increased up to 20 % was obtained by laser hammer.Further, the numerical calculations of the finite-element method analysis was in good agreement with the experimental results of the tilt angles of PWS ranged from 0.4 x 10-2 to 3.4 x 10-2 degree. The results of this study showed that the PWS state of being properly adjusted in coaxial laser module packages and led to fabricating reliable optoelectronic packaging with high yield.

• Periodical: Applied Mechanics and Materials (Volumes 284-287)
• Pages: 456-460
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.284-287.456
• Online since: January 2013
• Authors: Maw Tyan Sheen
• Keywords: Butterfly Laser Module, Laser Weld, Transistor Outline (TO)

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