Analysis on the Drop of PCB Packaged by Cushion Material Based on Finite Element Method

Abstract:

This paper analyzes the stress of the printed circuit board (PCB) packaged by cushion materials after drop and investigates the stress of PCB under the different drop height, different cushion materials and different drop ground using ANSYS finite element software. The stress of PCB is analyzed quantitatively and qualitatively after drop, the results show: (1) The stress of the product is effected by drop height and the performance of dropping ground in a large extent; (2) The protect performance varies with the ways of cushioning packaging; (3) Within a certain range, the cushion material with smaller elastic modulus is better due to absorb the impact more energy and can bear the impact force is greater.

• Periodical: Applied Mechanics and Materials (Volume 288)
• Pages: 303-307
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.288.303
• Online since: February 2013
• Authors: Gai Mei Zhang, Heng Yi Guo, Yue Lou, Qi Lu Tao, Wei Yuan, Jian Dong Lu
• Keywords: Circuit Board, Cushion Packaging, Drop Test, Finite Element

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