Manufacturing and Microstructure of Cu Coated Diamonds/SnAgCu Composite Solder Bumps

Abstract:

Diamonds/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu (SAC) solder paste and then reflowed at 260°C for 60s. Chemical copper plating method was proved to be an efficient way to achieve high addition amount of diamond particles (> 1 wt.%, which is much better than former studies) in solder, and to get solder bumps with better morphology. The spreading rate of this novel solder was turned out to be acceptable in operating range. Shear strength and microstructure of composite solder bumps were studied, showing that they could be influenced by the changes in morphology of the Ag3Sn net work caused by the various additions of Cu coated diamond particles.

• Periodical: Applied Mechanics and Materials (Volume 288)
• Pages: 323-327
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.288.323
• Online since: February 2013
• Authors: Y. Zhong, W. Zhang, C.Q. Wang, B. Li
• Keywords: Composite Solder, Diamonds, Microstructure, Plating, Reliability

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