Surface Warpage Measurement of Wood at Elevated Temperature by Shadow Moiré Method

Terry Yuan Fang Chen; Yu Sheng Chen

doi:10.4028/www.scientific.net/AMM.303-306.799

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 303-306Surface Warpage Measurement of Wood at Elevated...

Surface Warpage Measurement of Wood at Elevated Temperature by Shadow Moiré Method

Abstract:

A full-field method to measure the surface warpage of wood plate at elevated temperature by phase-shifted shadow moiré method is presented. Test of the method on a cypress wood plate is demonstrated. A comparison of the test results at room temperature to the ones obtained by contact type sensor was made. A good agreement between them is shown. Further measurement of the plate warpage at elevated temperature reveals the warping behavior of wood plate.

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Periodical:

Applied Mechanics and Materials (Volumes 303-306)

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799-802

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.303-306.799

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Online since:

February 2013

Authors:

Terry Yuan Fang Chen, Yu Sheng Chen

Keywords:

Phase Shift, Shadow Moiré Method, Warpage Measurement, Wood

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