[1]
Malacara, D., Twyman-Green interferometer, in Optical Shop Testing, ch. 2, Wiley, (1992).
DOI: 10.1002/9780470135976.ch2
Google Scholar
[2]
Moore, A. J., and Tyrer, J. R., An electronic speckle pattern interferometry for complete in-plane displacement measurement, Meas. Sci. Technol., vol. 1, p.1024–1030, (1990).
DOI: 10.1088/0957-0233/1/10/006
Google Scholar
[3]
Park, T. -S., Suresh, S., Rosakis, A. J., and Ryu, J., Measurement of fullfield curvature and geometrical instability of thin film-substrate systems through CGS interferometry, J. Mech. Phys. Solids, vol. 51, p.2191–2211, (2003).
DOI: 10.1016/j.jmps.2003.09.031
Google Scholar
[4]
Liou, N. -S. and Huang, C. -Y., Fourier transform Moiré strain analysis by using cross grating produced from iron-on paper and ink-jet printer, Polymer Testing, vol. 22, p.487–490, (2003).
DOI: 10.1016/s0142-9418(02)00051-x
Google Scholar
[5]
Vrinceanu, I. D. and Danyluk, S., Measurement of residual stress in single crystal silicon wafers, in Proc. 8th Int. Symp. Adv. Packag. Mater., p.297–301, (2002).
DOI: 10.1109/isapm.2002.990402
Google Scholar
[6]
Wang, Y. and Hassell, P., On-line measurement of thermally induced warpage of BGA's with high sensitivity shadow Moiré, Int. J Microcirc. Electron. Packag., vol. 23, p.191–196, (1998).
Google Scholar
[7]
Post, D., Han, B., and Ifju, P., High Sensitivity Moiré., Springer-Verlag, New York, (1994).
Google Scholar
[8]
Macy, W.W., Two-Dimensional Fringe-Pattern Analysis, Applied Optics, Vol. 22 No. 23, 3898-3901, (1983).
DOI: 10.1364/ao.22.003898
Google Scholar