The Study of Specific Materials Used by the Copper Wiring CMP of GLSI

Yu Ling Liu; Juan Wang; Bao Hong Gao

doi:10.4028/www.scientific.net/AMM.307.368

Paper Titles

Observation of Wear Surface between Pure PEEK and Counterpart Materials; Titanium and 7075 Aluminum Alloy, in Robot Joint
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Calorimetric Analysis of Precipitation in Undercooled Ni-Si Alloy
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Quantitative Research on Strength Characteristics of Phosphogypsum Consolidation Materials
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Analytical Solution of Thermal Stresses in a Functionally Graded Solid Cylinder within Parabolic Continuous Grading
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The Study of Specific Materials Used by the Copper Wiring CMP of GLSI
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Fourier Transform Infrared Spectroscopy for Wear Debris Adhesion on PEEK Bearing Surface
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Synthesis and Characterization of Functionalized Multi-Walled Carbon Nanotubes
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The Effect of Temperature on the Stick-Slip Friction Behavior of Optical Glasses in Precision Glass Molding
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Surface Stoichiometry and Oxidation of NiTi
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 307The Study of Specific Materials Used by the Copper...

The Study of Specific Materials Used by the Copper Wiring CMP of GLSI

Abstract:

In this paper, the multi-hydroxyl polyamines researched by ourselves are used in the slurry of the copper wiring CMP of GLSI, which makes the slurry alkalization. It also has the using as a pH adjusting agent, complexion agent of copper ion, multi- metal chelating agents, aminating agent of acidic oxides, pH buffer, stainless steel corrosion inhibitor, the active agent and pro-oxidant. It improves the property of slurry and solves many different of acidity slurry. The alkalinity slurry contained the multi-hydroxyl polyamines is environmental, inexpensive and composition- simplified. Without the toxic BTA which is must be used in the international and has side effect, the slurry can achieve the high speed and high flat. In the same time the low pressure and the little abrasive can be realized, which provide the new material for the removal of TSV copper film.

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Periodical:

Applied Mechanics and Materials (Volume 307)

Pages:

368-371

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.307.368

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Online since:

February 2013

Authors:

Yu Ling Liu, Juan Wang, Bao Hong Gao

Keywords:

CMP, Copper Wiring, Specific Materials

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