Electrochemical Corrosion Behavior of Cu15Ni10Mn Alloy in NaCl Solution

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Investigating the electrochemical corrosion behavior of Cu15Ni10Mn alloy in NaCl solution with different Cl concentration was studied by measuring open-circuit potential, potentiodynamic polarization, electrochemical impedance spectroscopy (EIS) and cyclic voltammetry. The results show that as the Cl- concentration increase, the corrosion potentials of the alloy shifted negatively, corrosion currents increase, the corrosion process by electrochemical control change of diffusion control, and therefore the corrosion rates become faster. The presence of Cl- have effect on the dissolution mechanism and corrosion products of the alloy, when the concentration of Cl- is relatively low, a reducing peak current appears in the process of cyclic voltammetry retracing , when the Cl- concentration is higher, cyclic voltammetry flyback process does not appear to restore the current peak. This is mainly associated with the generation of corrosion product, when Cl- concentration is low, the corrosion product is Cu2(OH)3Cl (basic copper chloride) and other two copper ion salts, when the concentration of Cl-is higher, corrosion products are mainly Cu2(OH)3Cl (basic copper chloride).

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23-27

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July 2013

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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[1] Dong Shangbo. Study on Corrosion of 5052 Aluminum Alloy in Seawater, Tianjin University, (2010).

Google Scholar

[2] N.W. Farro, L. Veleva, P. Aguilar. Copper Marine Corrosion: I. Corrosion Rates in Atmospheric and Seawater Environments of Peruvian Port, The Open Corrosion Journal, 2009, 2, 130~138.

DOI: 10.2174/1876503300902010130

Google Scholar

[3] Pan Qihan. A highly elastic Cu-20Ni-20Mn alloy, Transactions of nonferrous metals society of china, 1996, 6(4): 91~95.

Google Scholar

[4] Joon Hwan Choi, Dong Nyung Lee. Aging characteristics and precipitate analysis of Cu-Ni-Mn-P alloy, Materials Science and Engineering A, 2007, 458: 295~302.

DOI: 10.1016/j.msea.2006.12.074

Google Scholar

[5] Tian Rongzhang, Wang Zhutang. Handbook of copper alloy and its processing, Chang Sha: Central South University press, (2002).

Google Scholar

[6] Gavele J R, Torrest R M, Carranza R M. Passivity breakdown, its relation to pitting and stress-corrosion- cracking process, Corros. Sci., 1990, 31: 563~571.

DOI: 10.1016/0010-938x(90)90163-y

Google Scholar

[7] Pistorius P C, Buretein G T. Growth of corrosion pits on stainless steel in chloride solution containing dilute sulphate, Corros. Sci., 1992, 33: 1885~1897.

DOI: 10.1016/0010-938x(92)90191-5

Google Scholar

[8] Tang Yongming, Cao Bin, YangWenzhong. Study on anodic dissolution of copper in 3. 5%NaCl , Corrosion Science and Protection Technology, 2007, 19(5): 342~344.

Google Scholar

[9] Fu Liying, Chen Zhongxing, Cai Lankun. Effect of PH and chloride on corrosion of bronze [J]. Corrosion Science and Protection Technology, 2000, 21(7): 294~296.

Google Scholar

[10] Wang Julin, Xu Chunchun. Mechanism of formation process of pure Cu crystals in bronze corrosion [J]. The Chinese Journal of Nonferrous Metals, 2004, 14(11): 1869~1874.

Google Scholar

[11] Wang Peng. Tarnishing Mechanism and Anti-tarnishing Techniques of Copper and Brass Coins [D]. Liao Ning: Dalian University of Technology, (2009).

Google Scholar