Efficient Inspection Algorithm for IC Solder Joints Based on Feature Statistical Analysis

Hong Wei Xie; Kun Zhang

doi:10.4028/www.scientific.net/AMM.365-366.688

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 365-366Efficient Inspection Algorithm for IC Solder...

Efficient Inspection Algorithm for IC Solder Joints Based on Feature Statistical Analysis

Abstract:

An efficient feature statistical analysis based inspection algorithm for IC solder joint inspection is proposed. The defect detection is divided into training stage and test stage. In the training stage, three simple but efficient features are extracted and trained with Greedy Expectation-Maximization method. In the test stage, sub-regions are tested using the critical features. The defect diagnosis rules are defined to determine the specific defect types. To evaluate the performance of the proposed method, experiment was performed, and the inspection results have verified the effectiveness of proposed method.

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Periodical:

Applied Mechanics and Materials (Volumes 365-366)

Pages:

688-691

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.365-366.688

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Online since:

August 2013

Authors:

Hong Wei Xie, Kun Zhang

Keywords:

Automatic Optical Inspection, Printed Circuit Board (PCB), Solder Joint Classification

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