Analysis of Warpage and Optimization of Parameter for Thin-Wall Plastic Part Moldflow-Based Software

Qiu Hua Sun; Ming Wei Wang; Ren Pan; Wen Xin; Hong Yan Lv

doi:10.4028/www.scientific.net/AMM.377.133

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Analysis of Warpage and Optimization of Parameter for Thin-Wall Plastic Part Moldflow-Based Software
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 377Analysis of Warpage and Optimization of Parameter...

Analysis of Warpage and Optimization of Parameter for Thin-Wall Plastic Part Moldflow-Based Software

Abstract:

The injection molding process of plastic parts is simulated and analyzed through a three-dimensional model of bottom cover of USB (Universal Serial Bus) extender obtained by Pro/E software and MPI module of Moldflow software. Orthogonal test is applied to analyze the influence of press time, press pressure, mold temperature and melt temperature on the warpage of plastic parts. Those being influenced by factors above are listed in order as press pressure, melt tempreture, mold tempreture and press time. The optimum parameters are obtained by analyzing effect trend that the four factors can influence on warpage.

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Periodical:

Applied Mechanics and Materials (Volume 377)

Pages:

133-137

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.377.133

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Online since:

August 2013

Authors:

Qiu Hua Sun, Ming Wei Wang, Ren Pan, Wen Xin, Hong Yan Lv

Keywords:

Moldflow, Orthogonal Test, Thin-Wall Plastic Part, Warpage Analysis

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