Effect of Temperature Change on Capacitance of RF MEMS Clamped-Clamped Capacitive Switch

Abstract:

The effects of temperature change on the pull-in behavior and on the capacitance of the RF MEMS clamped-clamped capacitive switch are quite heavy because of the larger slenderness ratio of the MEMS clamped-clamped switch beam. A one-dimensional three-stage static model with temperature change for analyzing the beam was presented based on the small displacement assumptions, in which the clamped-clamped beam was subjected to both the electrostatic forces and the temperature change. First, the model was used to calculate the capacitance of the RF MEMS clamped-clamped capacitive switch in different states. Then , the effects of temperature change on the capacitance of the clamped-clamped capacitive switch for some different geometry dimensions were analyzed. From the analysis the effect of some geometry dimensions, such as the length of the beam, the depth of the beam and so on, at different temperature changes on the capacitance can be understood and some conclusions may be useful to the design of the MEMS clamped-clamped capacitive switch with the temperature change.

• Periodical: Applied Mechanics and Materials (Volume 389)
• Pages: 533-541
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.389.533
• Online since: August 2013
• Authors: Tian Jie Cao
• Keywords: Capacitance Switch, MEMS, Pull-In Voltage, Temperature Change

References

[1] K.E. Petersen. Micromechanical membrane switches on silicon. IBM Journal of Research and Development archive, Vol. 23(1979), p.376～385.

DOI: 10.1147/rd.234.0376

[2] Zhang L X，Zhao Y P. Electromechanical model of RF MEMS switches. Microsystem. Technologies, Vol. 9(2003), p.420～426.

DOI: 10.1007/s00542-002-0250-2

[3] Srikar V T, Spearing S M. Materials selection for microfabricated electrostatic actuators. Sensors and Actuators A, Vol. 102(2003), p.279～285.

DOI: 10.1016/s0924-4247(02)00393-x

[4] Tang M，Agarwal A , Win P, et al. A new lateral RF switch using soi-deep-etching fabrication process. International Journal of Computational Engineering Science, Vol. 4(2003), p.369～372.

DOI: 10.1142/s1465876303001290

[5] Subrahmanyam Gorthi, Atanu Mohanty, Anindya Chatterjee. Cantilever beam electrostatic MEMS actuators beyond pull-in. Journal of Micromechanics and Microengineering. Vol. 16(2006), p.1800～1810.

DOI: 10.1088/0960-1317/16/9/007

[6] Cao TianJie, Ding Fang. Static analysis for MEMS switch consisting of a fixed-fixed beam with the effect of temperature, Chinese Journal of Mechanical Engineering, Vol. 43(7)(2007), p.56～62(in Chinese).

DOI: 10.3901/jme.2007.07.056

[7] Ghader Rezazadeh. A comprehensive model to study nonlinear behavior of multilayered micro beam switches. Microsystem Technol, Vol. 14(2007), p.135～141.

DOI: 10.1007/s00542-007-0398-x

[8] Gilbert J. R., Legtenberg R., Senturia S. D., 3D coupled electromechanics for MEMS: applications of CoSolve-EM，in Proc. Int. Conf. on MEMS, Amsterdam(1995), p.122～127.

DOI: 10.1109/memsys.1995.472542

[9] Gilbert J. R., Ananthasuresh G.K., Senturia S. D. 3D modeling of contact problems and hysteresis in coupled electro-mechanics, in Proc. 9th Int. Workshop on Microelectromechanical Systems, Cambrige, Massachusetts (1996), p.127～132.

DOI: 10.1109/memsys.1996.493841

[10] Haslina Jaafar, Fong Li Nan, Nurul Amziah Md Yunus. Design and Simulation of High Performance RF MEMS Series Switch, in 2011 IEEE Regional Symposium on Micro and Nanoelectronics, Kota Kinabalu, Sabah(2011), p.349～354.

DOI: 10.1109/rsm.2011.6088358

[11] Cao Tian-Jie. Theoretical Analysis to Capacitance of RF MEMS Clamped-Clamped Capacitive Switch, Sensors &Transducers, Vol. 142(7) (2012), pp.76-86.

[12] P. M. Zavracky, S. Majumder, and N. E. McGruer, Micromechanical switches fabricated using nickel surface micromachining, Journal of Microelectromechanical System, Vol. 69(1)(1997), p.3～9.

DOI: 10.1109/84.557524

[13] W. C. Young, R. G. Budynas. Roark's formulas for stress and strain (7th Edition), Tsinghua University Press, Beijing(2003).

[14] Ferdinand P. beer, E. Russell Johnston, Jr., John T. DeWolf. Mechanics of Materials (3rd Edition), Tsinghua University Press, Beijing(2003).

[15] M. A. Grtétillat, Y. J. Yang, E. S. Hung, V. Rabinovich, G. K. Ananthasuesh,N. F. Rooij, and S. D. Senturia. Nonlinear electromechanical behavior of an electric microrelay, in Proc. 1997 International Conference on Solid-state Sensors and Actuators, Chicago(1997).

DOI: 10.1109/sensor.1997.635406

[16] E. S. Hung and S. D. Senturia. Generating efficient dynamical models for microelectromechanical systems from a few finite-element simulations runs, Journal of Microelectromechanical System, Vol. 8(3)(1999), p.280～289.

DOI: 10.1109/84.788632