Solder Short Reject Reduction in Soft Solder Die Attach (SSD) Process Using Mechanical Solder Shield Design

Amirul Abd Rashid; Kai Yun Yow; Saad Nor Hayati; Rashiddy  Wong Freddawati

doi:10.4028/www.scientific.net/AMM.391.127

Paper Titles

Research on Simulation of Kinematics and Dynamics for Planner Six-Bar Mechanism Based on MATLAB/Simulink
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Second Order Recurrent Neural Network for the Inverse Kinematics of Redundant Manipulators
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Time Efficient Testing of Hybrid Electric Vehicles Using Automated Identificated Physical Model Structures
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Training Equipment Design for Repairing Aircraft Fuel System Based on CAN Bus
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Solder Short Reject Reduction in Soft Solder Die Attach (SSD) Process Using Mechanical Solder Shield Design
p.127

Design and Static Analysis of an Addendum Modified Helical Gear Tooth
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Optimization Design of Connecting Rod in Twin-Rotor Cylinder-Embedded Piston Engine
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The Effect of Nose Bluntness and Forebody Strakes on Aerodynamic Characteristics of Air-Launched Rocket Model
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Research of Hard Fault Diagnosis Simulation Platform of Aero-Engine's Key Sensors Based on Neural Network
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 391Solder Short Reject Reduction in Soft Solder Die...

Solder Short Reject Reduction in Soft Solder Die Attach (SSD) Process Using Mechanical Solder Shield Design

Abstract:

This paper presents a development of mechanical solder shield, which was integrated to the Soft Solder Dispenser (SSD) die attach machine. The innovation of the mechanical shield has proven its ability to prevent the molten solder overflows to the lead area of the device. As a result, it reduced number of solder short defects. The manufacturing assembly yield is maintained at the highest level; ensuring fitness for function and production cost of the product remain competitive.

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Periodical:

Applied Mechanics and Materials (Volume 391)

Pages:

127-131

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.391.127

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Online since:

September 2013

Authors:

Amirul Abd Rashid, Kai Yun Yow, Saad Nor Hayati, Rashiddy Wong Freddawati

Keywords:

Die Attach, Soft Solder Dispenser, Solder Shield, Solder Short, Yield Improvement

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References

[1] V. DelBo, F. Bartels, A. Scandurra, Ch. Luechinger, and S. Radeck : 11th Eur. Microelectron (1997), p.308–319.

Google Scholar

[2] C. Beddingfield and L. M. Higgins: IEEE Trans. Comp. Vol. 21(1998), p.189–195.

Google Scholar

[3] T. Christopher, H. Olivier, A. Souad, B. Ferdinand, L. Petra and R. Markus : Shanghai SEMI (2002).

Google Scholar

[4] Information on http: /wenku. baidu. com/view/172607d084254b35eefd342c. html.

Google Scholar

[5] A. Souad and K. Daniel: Electronic Journal Japan (2001).

Google Scholar

[6] Y.S. Lee and C. E. Tan: 31st Electronics Manufacturing and Technology Conference (2006), pp.230-235.

Google Scholar

[7] V. Solberg and V. Oganesian: Electronic Packaging Technology Conference (2009), pp.27-30.

Google Scholar

[8] K.E. Yokohama, G. Akerling, A.D. Smith, M. Wire: Applied Superconductivity IEEE Transaction (1997), pp.2631-2634.

Google Scholar

[9] D. Olsen, and H. Berg : Components, Hybrids, and Manufacturing Technology, IEEE Transactions on 2, no. 2 (1979), pp.257-263.

Google Scholar

[10] K. K. Lam, P. Tu, and C. H. S. Ip, U.S. Patent Application 12/773, 099. (2010).

Google Scholar

[11] Rettenmayr, M., Lambracht, P., Kempf, B., & Graff: Advanced engineering materials Vol. 7(2005), pp.965-969.

Google Scholar