Study of Semi-Bond Abrasive in Tiny Grinding Wheel Based on Magnetorheological Effect

Jing Fu Chai; Wen Qing Song; Qiong Zou

doi:10.4028/www.scientific.net/AMM.395-396.1040

Paper Titles

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The Research on Milling Force in High-Speed Milling Nickel-Based Superalloy of Inconel 718
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Study of Semi-Bond Abrasive in Tiny Grinding Wheel Based on Magnetorheological Effect
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Electroplated Diamond Wire Saw Applying Ultrasonic Vibration to Cut Polysilicon Experiment and Simulation Analysis
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Effect of the Vibration on Machining Gap of WEDM
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 395-396Study of Semi-Bond Abrasive in Tiny Grinding Wheel...

Study of Semi-Bond Abrasive in Tiny Grinding Wheel Based on Magnetorheological Effect

Abstract:

To achieve ultra-precision machining efficiently, the tiny grinding wheel based on MR effect is used as a grinding tool. In this paper, the state of abrasive in cutting process was analyzed through modeling, and the grinding experiment was performed on the optical glass (K9). Study results show that, with the increasing of grinding time, the surface roughness of workpiece is reduced and tends to be uniform, but the material removal rate is reduced. The abrasive of tiny grinding wheel based on MR effect can automatically adjust its grinding pressure and depth of cut to improve the surface quality.

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Periodical:

Applied Mechanics and Materials (Volumes 395-396)

Pages:

1040-1043

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.395-396.1040

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Online since:

September 2013

Authors:

Jing Fu Chai, Wen Qing Song, Qiong Zou

Keywords:

Abrasive, Cutting State, Magnetorheological (MR) Effect, Mechanism of Action

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