Electroplated Diamond Wire Saw Applying Ultrasonic Vibration to Cut Polysilicon Experiment and Simulation Analysis

Abstract:

In this paper, on the basis of a large number of literature at home and abroad are summarized, we used the complete with independent intellectual property rights ultrasound wire-cutting processing machine tool to carry out machining experiment , and the ultrasonic wire cutting mechanism and process was carried out in-depth study. The results showed: compared with ordinary sawing, the cutting efficiency of applying ultrasonic action was high, its cutting force and surface roughness was small, at the same time ,used the software of ABAQUS finite element simulation analysis, and further studied on the law of electroplated diamond wire saw ultrasonic vibration cutting of composite processing technology process.

• Periodical: Applied Mechanics and Materials (Volumes 395-396)
• Pages: 1044-1048
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.395-396.1044
• Online since: September 2013
• Authors: Liao Yuan Zhang, Shuo Wang, Zhong Qing Shao, Zhong Xiu Lv
• Keywords: Electroplated Diamond Wire Saw, Polycrystalline Silicon, Ultrasonic Processing

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