Reliability Failure Analysis of PCB and its Technological Improvement

Li Fang Zhu

doi:10.4028/www.scientific.net/AMM.401-403.391

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 401-403Reliability Failure Analysis of PCB and its...

Reliability Failure Analysis of PCB and its Technological Improvement

Abstract:

Reliability failure analysis is extremely important in the manufacturing process of PCB (Printed Circuit Board). In this paper, we use thermal shock test method to analysis the electrical interconnection reliability of PCB in harsh environment. Also taking into account the reliability of PCB is closely related to its design and technology, approaches of technological improvement are proposed. Finally through temperature shock test method, the results show that the reliability of PCB designed with improved technology is enhanced.

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Periodical:

Applied Mechanics and Materials (Volumes 401-403)

Pages:

391-394

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.401-403.391

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Online since:

September 2013

Authors:

Li Fang Zhu

Keywords:

Printed Circuit Board (PCB), Reliability Failure Analysis, Technological Improvement, Thermal Shock Test

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References

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