Behaviors of Immersion Flow in Micro-Gap with Moving Boundary

Hui Chen; Heng Du

doi:10.4028/www.scientific.net/AMM.423-426.894

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 423-426Behaviors of Immersion Flow in Micro-Gap with...

Behaviors of Immersion Flow in Micro-Gap with Moving Boundary

Abstract:

In order to improve the flow stability when wafer scans at high speed, immersion lithography with small flow-thickness is proposed for the high resolution lithography. By using the three-dimensionally numerical methods, the immersion flow in micro-gap is investigated to analyze the behaviors of liquid flow. Based on the flow characteristics of typical structures with different liquid thickness and scanning speed, the liquid mean-velocity on account of thousand sample points in the exposure area are studied, and the appropriate parameters and method of effective renovation with small thickness are also given.