Numerical Simulation Investigation on the Temperature Field Distribution and Variations in Hot Stamping Process

Lei Zhang; Guo Qun Zhao; Hui Ping Li

doi:10.4028/www.scientific.net/AMM.44-47.992

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 44-47Numerical Simulation Investigation on the...

Numerical Simulation Investigation on the Temperature Field Distribution and Variations in Hot Stamping Process

Abstract:

With finite element software Abaqus, a coupled thermal mechanical simulation of hot stamping process of U-Channel part using high strength steel was performed. Through the analysis of the temperature field distribution on the die surface, the influence of contact state between die and blank on the temperature field distribution was discussed. With temperature history curve of a selected node on die corner, the heat flow on two contact boundaries (die surface and cooling water channel surface) was discussed and its effects rules on the die temperature were given.

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Periodical:

Applied Mechanics and Materials (Volumes 44-47)

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992-996

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.44-47.992

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Online since:

December 2010

Authors:

Lei Zhang, Guo Qun Zhao, Hui Ping Li

Keywords:

Die, Heat Transfer, Hot Stamping, Temperature

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