Numerical Simulation Investigation on the Temperature Field Distribution and Variations in Hot Stamping Process

Abstract:

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With finite element software Abaqus, a coupled thermal mechanical simulation of hot stamping process of U-Channel part using high strength steel was performed. Through the analysis of the temperature field distribution on the die surface, the influence of contact state between die and blank on the temperature field distribution was discussed. With temperature history curve of a selected node on die corner, the heat flow on two contact boundaries (die surface and cooling water channel surface) was discussed and its effects rules on the die temperature were given.

Info:

Periodical:

Edited by:

Ran Chen

Pages:

992-996

DOI:

10.4028/www.scientific.net/AMM.44-47.992

Citation:

L. Zhang et al., "Numerical Simulation Investigation on the Temperature Field Distribution and Variations in Hot Stamping Process", Applied Mechanics and Materials, Vols. 44-47, pp. 992-996, 2011

Online since:

December 2010

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Price:

$35.00

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