Sintering of Alumina-AIN System for Heat Sink

Abstract:

Aluminium alloys is widely applied in heat sink but its application of heat absorption is still unsatisfied. While, Aluminum Nitride (AIN) was discovered as another option for heat sink application because of its great thermal conductivity and it also has high electrical conductivity at high temperature. Thus, the mechanical and chemical properties of a sintered mixed powder of Alumina and AIN are investigated experimentally. There are five different compositions of mixed powder of Alumina-AIN and sintered at three different sintering temperatures which are 1400°C, 1500°C and 1600°C. As applying a high sintering temperature on samples inducted great flexural strength and increase it modulus of rupture. High sintering temperature (1600°C) also affected the materials microstructure as the particle was arranged closely between each other and reduces the amount of porosity. The application of high temperature in the mixture of AIN with Alumina reduces the occurrence of flaws like cracking and accordingly improves the strength. These combination of Alumina-AIN brought acceptable result in thermal conductivity value analysis and as well enhancing the thermal conductivity.

• Periodical: Applied Mechanics and Materials (Volumes 465-466)
• Pages: 76-80
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.465-466.76
• Online since: December 2013
• Authors: Nor Hafiez Mohamad Nor, Ismail Muhammad Hussain, Nur Atikah Abu Kasim, Wan Dung Teng, M.K. Idham
• Keywords: Aluminum Nitride (AlN), Cold Isostatic Pressing, Heat Sink, Powder metallurgy

References

[1] Randeep Singh, Aliakbar Akbarzadeh, Masataka Mochizuki, Sintered porous heat sink for cooling of high-powered microprocessors for server applications, International Journal of Heat and Mass Transfer, Volume 52, Issues 9-10, (2009).

DOI: 10.1016/j.ijheatmasstransfer.2008.11.016

[2] A. Verma, R. Chatterjee, J. Magn. Material. Volume 306 (2006) Page 313.

[3] Shamima Choudhury, Mahabub Alam Bhuiyan, Sheikh Manjura Hoque, Effect of Sintering Temperature on Apparent Density and Transport Properties of NiFe204: Synthesized from Nano Size Powder of NiO and Fe203, Int. Nano Lett., Vol 1, No. 2, July 2011, pp.111-116.

DOI: 10.1186/2228-5326-2-6

[4] R. T. De Hoff and E.H. Aigeltinger, Experimental Quantitative Microscopy with special application to sintering, Advanced Experimental Techniques In Powder Metallurgy, J.S. Hirshhorn and K.H. Roll (eds. ), Pleenum Press, New York, 1970, pp.81-137.

DOI: 10.1007/978-1-4615-8981-5_5

[5] Takekazu Nagae, Masaru Yokota, Masateru Nose, Shogo Tomida, Katsumasa Otera, Takashi Kamiya, Shigeoki Saji, Microstructure and Mechanical Properties or Gas Atomized Aluminum Alloy Powder Compact Densified By Pulsed Current Pressure Sintering Process, Material Transactions, Volume 43, No. 3 (2002).

DOI: 10.2320/matertrans.43.537

[6] Yen-Shu Chen, Kuo-Hsiang Chien, Tzu-Chen Hung, Chi-Chuan Wang, Yuh-Ming Ferng, Bau-Shei Pei, Numerical simulation of a heat sink embedded with a vapor chamber and calculation of effective thermal conductivity of a vapor chamber, Applied Thermal Engineering, Volume 29, Issue 13, September (2009).

DOI: 10.1016/j.applthermaleng.2008.12.009

[7] W.A. Groen, J.G. van Lierop, J.M. Toonen, Electrical conductivity of AIN ceramics at high temperatures, Journal of the European Ceramic Society, Volume 11, Issue 4, (1993).

DOI: 10.1016/0955-2219(93)90036-q

[8] Xueli Du, Mingli Qin, Yue Sun, Zhihao Yuan, Baohe Yang, Xuanhui Qu, Structure and thermal conductivity of powder injection molded AIN ceramic, Advanced Powder Technology, Volume 21, Issue 4, July (2010).

DOI: 10.1016/j.apt.2010.01.001

[9] Koji Atarashiya, Aluminum nitride/metal composites using ultra-fine aluminum particles and their application for joining, (1995) pages 54-59.

DOI: 10.1016/0924-0136(95)01919-7

[10] K.C. Nayak, S.K. Saha, K. Srinivasan, P. Dutta, A numerical model for heatsinks with phase change materials and thermal conductivity enhancers (2006) Pages 1833 – 1844.

DOI: 10.1016/j.ijheatmasstransfer.2005.10.039

[11] Ming-Jer Jeng, Kuo-Ling Chiang, Hsin-Yi Chang, Chia-Yi Yen, Cheng-Chen Lin, Yuan-Hsiao Chang, Mu-Jen Lai, Yu-Lin Lee, Liann-Be Chang Heatsink performances of GaN/InGaN flip-chip light-emitting diodes fabricated on silicon and AIN submounts, May 2012, Pages 884 – 888.

DOI: 10.1016/j.microrel.2011.04.013