Internal Defect Measurement of Bonding Structure Based on Infrared Thermal Image

Li Hua Yuan; Guan Hua Wu; Wei Wu

doi:10.4028/www.scientific.net/AMM.470.132

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 470Internal Defect Measurement of Bonding Structure...

Internal Defect Measurement of Bonding Structure Based on Infrared Thermal Image

Abstract:

The internal defects of bonding structure of 2A50 block wrought aluminum were researched by a sequence thermal images which were obtained in the cooling process by thermal infrared imager with thermal excitation. Each image in the sequence could visually reveal internal defects of the specimen, which shapes projected on the surface. And sequence diagrams could reflect the differences between the temperature gradient of the defects and that of the uniform in the cooling process. Moreover, the more continuous and smooth edges of defects were obtained by rotating track the maximum gradient edge detection method in order to further quantify the size of the defects. The test results showed that infrared thermal imaging technology should be the rapid and effective method to detect internal defects of composite materials.

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Periodical:

Applied Mechanics and Materials (Volume 470)

Pages:

132-136

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.470.132

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Online since:

December 2013

Authors:

Li Hua Yuan*, Guan Hua Wu, Wei Wu

Keywords:

Bonding Structure, Defect Measurement, Edge Detection, Infrared Thermal Image

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